Abstract: A valve assembly may provide a body comprising a bottom portion and a top portion having a threaded region, a closing mechanism situated above the top portion of the body, an actuator in communication with the closing mechanism, a nut configured to attach to the threaded region, and a threaded hole extending into at least one of the bottom portion of the body or the nut.

Abstract: A valve assembly may provide a body comprising a bottom portion and a top portion having a threaded region, a closing mechanism situated above the top portion of the body, an actuator in communication with the closing mechanism, a nut configured to attach to the threaded region, and a threaded hole extending into at least one of the bottom portion of the body or the nut.

Abstract: A chemical vessel is disclosed comprising a dip tube and a level sensor tube arranged in an elongated counterbore incorporated into a housing of the chemical vessel. The chemical vessel may be configured to allow a pushback routine to take place, whereby a level of liquid in the chemical vessel is reduced to a point that the dip tube is free from liquid inside the dip tube or at the bottom of the dip tube. Once the dip tube is free of the liquid, then a vacuum source may be used to purge vapor within the chemical vessel without the risk of damage to the vacuum source.

Abstract: A chemical vessel is disclosed comprising a dip tube and a level sensor tube arranged in an elongated counterbore incorporated into a housing of the chemical vessel. The chemical vessel may be configured to allow a pushback routine to take place, whereby a level of liquid in the chemical vessel is reduced to a point that the dip tube is free from liquid inside the dip tube or at the bottom of the dip tube. Once the dip tube is free of the liquid, then a vacuum source may be used to purge vapor within the chemical vessel without the risk of damage to the vacuum source.

Abstract: A chemical vessel used for holding a liquid chemical precursor is disclosed comprising a liquid level sensor tube. The liquid level sensor tube is configured to operate in an environment where the liquid chemical precursor is heated to a point of boiling or vaporization. The liquid level sensor tube comprises housing with a slot built in to prevent any false readings of sensors disposed within the liquid level sensor tube.

Abstract: A chemical vessel used for holding a liquid chemical precursor is disclosed comprising a liquid level sensor tube. The liquid level sensor tube is configured to operate in an environment where the liquid chemical precursor is heated to a point of boiling or vaporization. The liquid level sensor tube comprises housing with a slot built in to prevent any false readings of sensors disposed within the liquid level sensor tube.

Abstract: A valve assembly may provide a body comprising a bottom portion and a top portion having a threaded region, a closing mechanism situated above the top portion of the body, an actuator in communication with the closing mechanism, a nut configured to attach to the threaded region, and a threaded hole extending into at least one of the bottom portion of the body or the nut.

Abstract: Methods and apparatus for a cooled chemical cabinet include a cooling duct configured to cool a heatsink coupled to a thermoelectric module (TEM). The cooling duct includes a fan configured to pull air into an inlet duct and onto the heatsink. The air pulled in by the fan absorbs the heat from the heatsink. The cooling duct further includes an exhaust duct connected to the fan and configured to expel the heated air. The exhaust duct is configured to expel the heated air outside the chemical cabinet and away from the TEM.

Abstract: An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.

Abstract: A semiconductor device comprising a manifold for uniform vapor deposition is disclosed. The semiconductor device can include a manifold comprising a bore and having an inner wall. The inner wall can at least partially define the bore. A first axial portion of the bore can extend along a longitudinal axis of the manifold. A supply channel can provide fluid communication between a gas source and the bore. The supply channel can comprise a slit defining an at least partially annular gap through the inner wall of the manifold to deliver a gas from the gas source to the bore. The at least partially annular gap can be revolved about the longitudinal axis.

Abstract: A chemical vessel used for holding a liquid chemical precursor is disclosed comprising a liquid level sensor tube. The liquid level sensor tube is configured to operate in an environment where the liquid chemical precursor is heated to a point of boiling or vaporization. The liquid level sensor tube comprises housing with a slot built in to prevent any false readings of sensors disposed within the liquid level sensor tube.

Abstract: A chemical vessel is disclosed comprising a dip tube and a level sensor tube arranged in an elongated counterbore incorporated into a housing of the chemical vessel. The chemical vessel may be configured to allow a pushback routine to take place, whereby a level of liquid in the chemical vessel is reduced to a point that the dip tube is free from liquid inside the dip tube or at the bottom of the dip tube. Once the dip tube is free of the liquid, then a vacuum source may be used to purge vapor within the chemical vessel without the risk of damage to the vacuum source.