Patents by Inventor Andrew Mudie

Andrew Mudie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stud bump bonding in implantable medical devices
    Patent number: 9351436
    Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: May 24, 2016
    Assignee: Cochlear Limited
    Inventors: Milind Raje, Robert Bennett, Andrew Mudie, Gary Mark Ignacio
  • Stud Bump Bonding in Implantable Medical Devices
    Publication number: 20140254124
    Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Inventors: Milind Raje, Robert Bennett, Andrew Mudie, Gary Mark Ignacio