Abstract: A front opening unified pod (FOUP) for holding wafers is invertible and compatible with process machines in an inverted orientation. The FOUP can safely transport and store wafers while in a non-upright orientation. The shelves within the FOUP are capable of collapsing and constraining the wafers. Further, a method of holding wafers for processing is provided.

Abstract: A method and apparatus for a backside metallization of a wafer is provided. The wafer comprised of a first substance is bent by creating tension on a backside and creating compression on a front side prior to deposition of a thin film of a second substance. After deposition, the wafer is released and the thin film deposited on the wafer exhibits less tensile stress than if the thin film was deposited on a flat wafer.

Abstract: A front opening unified pod (FOUP) for holding wafers is invertible and compatible with process machines in an inverted orientation. The FOUP can safely transport and store wafers while in a non-upright orientation. The shelves within the FOUP are capable of collapsing and constraining the wafers. Further, a method of holding wafers for processing is provided.

Abstract: A carrier tape segment to carry a microelectronic component thereon. The carrier tape segment includes a tape segment body having a head portion and a tail portion, and a component carrying portion between the head portion and the tail portion. The head portion includes a first mechanical interlocking feature thereon. The tail portion includes a second mechanical interlocking feature thereon. The first mechanical interlocking feature is configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature is configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature. The carrier tape segment is thereby configured to be linked to other carrier tape segments to form a carrier tape chain therewith.