Patents by Inventor Andrew Padula
Andrew Padula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967217Abstract: A risk of fall detection system comprising: a wearable monitoring group configured to acquire posture data and comprising: a first sensor configured to be attached to a lower part of a user's torso and to detect the position of said lower part, a second sensor configured to be attached to an upper part of the user's torso and to detect the position of said upper part, a third sensor configured to be attached to at least one user's lower limb and to detect the position of said user's lower limb, a processing module in signal communication with the wearable monitoring group and configured to process the acquired posture data and to compute a risk of fall indicator parameter from the relative position of the lower part of user's torso, upper part of user's torso, and user's lower limb detected by the first, second and third sensor, respectively.Type: GrantFiled: March 10, 2023Date of Patent: April 23, 2024Inventors: Craig Andrews, William V. Padula, Chris Andrews
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Patent number: 11903872Abstract: A heat exchange module alone or part of a system including a control console. The HEM can include a channel enclosure assembly, a thermoelectric cooler (TEC) assembly and a heat transfer (cover) assembly. The enclosure assembly includes a channel for a heat-transfer liquid. The module can be constructed to provide for flexibility to better conform and fit on rounded and/or angular body parts and to efficiently transfer heat between the adjacent body part and the heat-transfer liquid via the TECs of the TEC assembly.Type: GrantFiled: September 20, 2018Date of Patent: February 20, 2024Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, HYPOTHERM DEVICES, INC.Inventors: Julio L. Vergara, Daniel M. Estrada, Mayank Kalra, Andrew Padula, Ryan Cohn
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Publication number: 20230093710Abstract: Optimized fluid channels, flexible thermoelectric electric coolers (“TECs”), and fixed frame therapeutic stations along with methods of making the same are disclosed herein. Consequently, the optimized fluid channels provide an improved HEM whereby the fluid seal is more secure, and the manufacturing is more easily completed. Moreover, the flexible TECs provide a more conformed design to the end user and allow for more focused and efficient heat transfer. Finally, the fixed frame therapeutic station(s) provide for a fixed frame which allows differential heating and cooling on the glabrous skin areas of a human to provide additive benefits during heating and cooling therapeutic regimes.Type: ApplicationFiled: December 9, 2020Publication date: March 23, 2023Inventors: Daniel Cuadra, Ryan Cohn, Andrew Padula, Julio L. Vergara
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Publication number: 20230053398Abstract: A heat exchange module having a heat transfer fluid channel and a heat transfer plate in heat transfer relation with fluid in the channel. The reference side of a thermoelectric cooler (TEC) is in thermal contact with the plate. A heat transfer tile is in thermal contact with a user side of the TEC. The module is configured to be operatively positionable with the tile in heat transfer relation with skin of a patient.Type: ApplicationFiled: August 23, 2022Publication date: February 23, 2023Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, HYPOTHERMIA DEVICES, INC.Inventors: Julio L. Vergara, Daniel M. Estrada, Mayank Kalra, Andrew Padula, Daniel E. Cuadra, Ryan C. Cohn
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Patent number: 11458038Abstract: A heat exchange module having a heat transfer fluid channel and a heat transfer plate in heat transfer relation with fluid in the channel. The reference side of a thermoelectric cooler (TEC) is in thermal contact with the plate. A heat transfer tile is in thermal contact with a user side of the TEC. The module is configured to be operatively positionable with the tile in heat transfer relation with skin of a patient.Type: GrantFiled: March 26, 2019Date of Patent: October 4, 2022Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, HYPOTHERMIA DEVICES, INC.Inventors: Julio L. Vergara, Daniel M. Estrada, Mayank Kalra, Andrew Padula, Daniel E. Cuadra, Ryan C. Cohn
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Patent number: 11419753Abstract: A heat exchanger module (HEM) and system uses a flexible substrate with one or more open channels, to which a substrate cover is bonded, thereby forming closed channels in the flexible substrate. Thermoelectric coolers (TECs) are attached to optional thermally diffusing copper squares atop the substrate cover. An interface cover is attached to the TEC tops, with a compliant thermally conductive material opposite the TECs and ultimately in contact with a patient. A liquid is passed through the closed channels, which act as thermal references for the TECs. Current is supplied by a controller to the TECs to induce TEC cooling or heating relative to the liquid. One or more temperature sensors detect the temperature of the interface cover, which are used as inputs to the control of the TEC supply current. The HEM may be used for heating, cooling, or cycling between heating and cooling for various medical uses.Type: GrantFiled: September 26, 2017Date of Patent: August 23, 2022Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Julio L. Vergara, Andrew Padula, Lucas Restrepo
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Patent number: 11419754Abstract: A heat exchange module alone or part of a system including a control console. The module includes a channel assembly and a heat exchange stack attached thereto, and can be used to directly cool and/or heat tissue or skin. The channel assembly includes a liquid channel. The stack can include a pair of spaced plates with thermoelectric coolers exchangers, heat reflective layers, and a core composite layer which keeps the plates spaced. To provide flexibility of the module to better fit on round body parts the stack can include a thermally-conductive plate construction between the plates which has rotational flexibility axes in the X and/or Y directions between plate portions. Optionally the channel can include windows to which the plate portions are sealed. The heat exchange stack separately or together with the channel assembly can be secured in the thickness direction with mechanical securements such as sewing or tacking to also provide for greater flexibility.Type: GrantFiled: September 20, 2018Date of Patent: August 23, 2022Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Julio L. Vergara, Andrew Padula, Daniel M. Estrada
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Patent number: 10449726Abstract: A method for reinforcing joints between one or more components is presented. Adhesive is applied to joint areas of contact between the components and the components are stitched together at the joint areas to ensure that the joints are mechanically stable enough to withstand stresses such as pressurization and external manipulation.Type: GrantFiled: January 16, 2017Date of Patent: October 22, 2019Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Julio Vergara, Andrew Padula, Lucas Restrepo
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Publication number: 20190262169Abstract: A heat exchange module having a heat transfer fluid channel and a heat transfer plate in heat transfer relation with fluid in the channel. The reference side of a thermoelectric cooler (TEC) is in thermal contact with the plate. A heat transfer tile is in thermal contact with a user side of the TEC. The module is configured to be operatively positionable with the tile in heat transfer relation with skin of a patient.Type: ApplicationFiled: March 26, 2019Publication date: August 29, 2019Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, HYPOTHERMIA DEVICES, INC.Inventors: Julio L. Vergara, Daniel M. Estrada, Mayank Kalra, Andrew Padula, Daniel E. Cuadra, Ryan C. Cohn
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Publication number: 20190099288Abstract: A heat exchange module alone or part of a system including a control console. The HEM can include a channel enclosure assembly, a thermoelectric cooler (TEC) assembly and a heat transfer (cover) assembly. The enclosure assembly includes a channel for a heat-transfer liquid. The module can be constructed to provide for flexibility to better conform and fit on rounded and/or angular body parts and to efficiently transfer heat between the adjacent body part and the heat-transfer liquid via the TECs of the TEC assembly.Type: ApplicationFiled: September 20, 2018Publication date: April 4, 2019Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, HYPOTHERMIA DEVICES, INC.Inventors: Julio L. Vergara, Daniel M. Estrada, Mayank Kalra, Andrew Padula, Ryan Cohn
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Publication number: 20190099287Abstract: A heat exchange module alone or part of a system including a control console. The module includes a channel assembly and a heat exchange stack attached thereto, and can be used to directly cool and/or heat tissue or skin. The channel assembly includes a liquid channel. The stack can include a pair of spaced plates with thermoelectric coolers exchangers, heat reflective layers, and a core composite layer which keeps the plates spaced. To provide flexibility of the module to better fit on round body parts the stack can include a thermally-conductive plate construction between the plates which has rotational flexibility axes in the X and/or Y directions between plate portions. Optionally the channel can include windows to which the plate portions are sealed. The heat exchange stack separately or together with the channel assembly can be secured in the thickness direction with mechanical securements such as sewing or tacking to also provide for greater flexibility.Type: ApplicationFiled: September 20, 2018Publication date: April 4, 2019Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Julio L. Vergara, Andrew Padula, Daniel M. Estrada
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Publication number: 20180098903Abstract: A heat exchanger module (HEM) and system uses a flexible substrate with one or more open channels, to which a substrate cover is bonded, thereby forming closed channels in the flexible substrate. Thermoelectric coolers (TECs) are attached to optional thermally diffusing copper squares atop the substrate cover. An interface cover is attached to the TEC tops, with a compliant thermally conductive material opposite the TECs and ultimately in contact with a patient. A liquid is passed through the closed channels, which act as thermal references for the TECs. Current is supplied by a controller to the TECs to induce TEC cooling or heating relative to the liquid. One or more temperature sensors detect the temperature of the interface cover, which are used as inputs to the control of the TEC supply current. The HEM may be used for heating, cooling, or cycling between heating and cooling for various medical uses.Type: ApplicationFiled: September 26, 2017Publication date: April 12, 2018Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Julio L. Vergara, Andrew Padula, Lucas Restrepo
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Publication number: 20170190102Abstract: A method for reinforcing joints between one or more components is presented. Adhesive is applied to joint areas of contact between the components and the components are stitched together at the joint areas to ensure that the joints are mechanically stable enough to withstand stresses such as pressurization and external manipulation.Type: ApplicationFiled: January 16, 2017Publication date: July 6, 2017Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Julio Vergara, Andrew Padula, Lucas Restrepo