Patents by Inventor Andrew R. Dick

Andrew R. Dick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chain Extenders And Formulations Thereof For Improving Elongation In Photosensitive Polyimide
    Publication number: 20220221791
    Abstract: Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 14, 2022
    Inventors: Andrew R. Dick, Jeffery D. Weckwerth
  • Surface Treatment Producing High Conductivity Vias With Simultaneous Polymer Adhesion
    Publication number: 20220205080
    Abstract: Treatment solutions and methods for treating a substrate including forming a first layer on a surface of the substrate, providing a process gas to the one or more plasma sources, the process gas includes a gas mixture of a reactive gas species and an inert gas species; forming a plasma under vacuum in the one or more plasma sources; and exposing the substrate to the plasma under vacuum to treat the first layer on the surface of the substrate.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 30, 2022
    Inventors: Douglas P. Riemer, Andrew R. Dick
  • Chain extenders and formulations thereof for improving elongation in photosensitive polyimide
    Patent number: 11294281
    Abstract: Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 5, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Andrew R. Dick, Jeffery D. Weckwerth
  • CHAIN EXTENDERS AND FORMULATIONS THEREOF FOR IMPROVING ELONGATION IN PHOTOSENSITIVE POLYIMIDE
    Publication number: 20200409265
    Abstract: Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.
    Type: Application
    Filed: January 17, 2020
    Publication date: December 31, 2020
    Inventors: Andrew R. Dick, Jeffery D. Weckwerth