Patents by Inventor Andrew R. Heyd

Andrew R. Heyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10206297
    Abstract: Systems, methods, apparatuses, and software for data systems are provided herein. In one example, a meshed computing architecture is presented that includes a midplane comprising PCIe interconnect, storage modules configured to couple to a first portion of the PCIe interconnect, controller modules configured to couple to a second portion of the PCIe interconnect, and fabric modules configured to couple to a third portion of the PCIe interconnect. The first portion of the PCIe interconnect communicatively couples each of the storage modules to each of the controller modules and each of the fabric modules, the second portion of the PCIe interconnect communicatively couples each of the controller modules to each of the fabric modules, and third portion of the PCIe interconnect communicatively couples the controller modules to each other.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: February 12, 2019
    Assignee: Liqid Inc.
    Inventors: Jason Breakstone, Andrew R. Heyd, Seth Walsh, Christopher R. Long, Michael D. Harrington
  • Publication number: 20170150621
    Abstract: Systems, methods, apparatuses, and software for data systems are provided herein. In one example, a meshed computing architecture is presented that includes a midplane comprising PCIe interconnect, storage modules configured to couple to a first portion of the PCIe interconnect, controller modules configured to couple to a second portion of the PCIe interconnect, and fabric modules configured to couple to a third portion of the PCIe interconnect. The first portion of the PCIe interconnect communicatively couples each of the storage modules to each of the controller modules and each of the fabric modules, the second portion of the PCIe interconnect communicatively couples each of the controller modules to each of the fabric modules, and third portion of the PCIe interconnect communicatively couples the controller modules to each other.
    Type: Application
    Filed: November 22, 2016
    Publication date: May 25, 2017
    Inventors: Jason Breakstone, Andrew R. Heyd, Seth Walsh, Christopher R. Long, Michael D. Harrington