Abstract: By using techniques for near field probes to measure dielectric values of blanket films, the measure of the sidewall damage of the patterned structure is calculated. The interaction between the near field probe and the etched structure is modeled to obtain the model total capacitance. The near field microwave probe is calibrated on a set of blanket films with different thicknesses, and the dielectric constant of the etched trench structure is calculated using the measured frequency shift and calibration parameters. The measured capacitance is further calculated for the etched trench structure using the dielectric constant and the total thickness of the etched trench structure. The effective dielectric constant of the structure under study is extracted where the model capacitance is equal to the measured capacitance. The measure of the sidewall damage is further calculated using the effective dielectric constant.

Abstract: A measurement technique based on a microwave near-field scanning probe is developed for non-contact measurement of dielectric constant of low-k films. The technique is non-destructive, non-invasive and can be used on both porous and non-porous dielectrics. The technique is based on measurement of resonant frequency shift of the near-field microwave resonator for a plurality of calibration samples vs. distance between the probe tip and the sample to construct a calibration curve. Probe resonance frequency shift measured for the sample under study vs. tip-sample separation is fitted into the calibration curve to extract the dielectric constant of the sample under study. The calibration permits obtaining a linear calibration curve in order to simplify the extraction of the dielectric constant of the sample under study.

Abstract: A method and system for non-contact measurements of microwave capacitance of miniature structures patterned on wafers used for production of modern integrated circuits. A near-field balanced two-conductor probe is brought into close proximity to a test key built on a wafer of interest and replicating the miniature structure of interest. The resonant frequency of the probe for the test key is measured. The probe is then positioned at the same distance from an “open” calibration key and “short” calibration key, and the resonance frequencies of the probe for the calibration keys are measured. A shear force distance control mechanism maintains the distance between the tip of the probe and the measured test key and calibration keys. The microwave capacitance of the test key is then calculated in accordance with a predefined formula.

Abstract: A probe for non-destructive determination of complex permittivity of a material and for near field optical microscopy is based on a balanced multi-conductor transmission line structure created on a dielectric substrate member which confines the probing field within a sharply defined sampling volume in the material under study. A method for manufacturing dielectric support member based probes includes anisotropically depositing a 50-100 ? thick underlayer of Cr, Ni, W or Ta onto the dielectric support member, anisotropically depositing conductive material onto the Cr, Ni, W or Ta underlayer, and removing the unwanted conductive material at the sides of the dielectric support member to electrically isolate the created conductive strips.

Abstract: In the method and system for non-contact measurements of microwave capacitance of test structures patterned on wafers used for production of modern integrated circuits, a near-field balanced two-conductor probe is brought into close proximity to a test structure, and the resonant frequency of the probe for the test structure is measured. The probe is then positioned at the same distance from the uniform metallic pad, and the resonance frequency of the probe for the uniform metallic pad is measured. A shear force distance control mechanism maintains the distance between the tip of the probe and the metallic pad equal to the distance between the tip of the probe and the test structure. The microwave capacitance of the test structure is then calculated in accordance with a predefined formula. The obtained microwave capacitance may be further used for determining possible defects of the test structure.

Abstract: A method for measuring a material's complex permittivity is provided where a near-field microwave probe is positioned a predetermined distance from a first and a second standard sample for measuring a relative resonant frequency shift of the near-field microwave probe for standard samples. Based on measurements, calibration coefficients are calculated. A relative resonant frequency shift of the near-field microwave probe for a sample under study is measured by fast frequency sweep technique while the distance between the tip of the probe and the sample under the study is maintained nominally at the distance between the tip of the probe and each standard sample during a calibration procedure by a shear-force based distance control mechanism. Also, the change in the quality factor of the probe for unloaded and loaded resonator is measured.

Abstract: In the method and system for non-contact measurements of microwave capacitance of test structures patterned on wafers used for production of modern integrated circuits, a near-field balanced two-conductor probe is brought into close proximity to a test structure, and the resonant frequency of the probe for the test structure is measured. The probe is then positioned at the same distance from the uniform metallic pad, and the resonance frequency of the probe for the uniform metallic pad is measured. A shear force distance control mechanism maintains the distance between the tip of the probe and the metallic pad equal to the distance between the tip of the probe and the test structure. The microwave capacitance of the test structure is then calculated in accordance with a predefined formula. The obtained microwave capacitance may be further used for determining possible defects of the test structure.

Abstract: A probe for non-destructive determination of complex permittivity of a material and for near field optical microscopy is based on a balanced multi-conductor transmission line structure created on a dielectric substrate member which confines the probing field within a sharply defined sampling volume in the material under study.

Abstract: A method for measuring a material's complex permittivity is provided where a near-field microwave probe is positioned a predetermined distance from a first and a second standard sample for measuring a relative resonant frequency shift of the near-field microwave probe for standard samples. Based on measurements, calibration coefficients are calculated. A relative resonant frequency shift of the near-field microwave probe for a sample under study is measured by fast frequency sweep technique while the distance between the tip of the probe and the sample under the study is maintained nominally at the distance between the tip of the probe and each standard sample during a calibration procedure by a shear-force based distance control mechanism. Also, the change in the quality factor of the probe for unloaded and loaded resonator is measured.

Abstract: A probe for non-destructive determination of complex permittivity of a material and for near field optical microscopy is based on a balanced multi-conductor transmission line structure created on a dielectric substrate member which confines the probing field within a sharply defined sampling volume in the material under study. A method for manufacturing dielectric support member based probes includes anisotropically depositing a 50-100 Å thick underlayer of Cr, Ni, W or Ta onto the dielectric support member, anisotropically depositing conductive material onto the Cr, Ni, W or Ta underlayer, and removing the unwanted conductive material at the sides of the dielectric support member to electrically isolate the created conductive strips.

Abstract: A probe for non-destructive determination of complex permittivity of a material and for near field optical microscopy is based on a balanced multi-conductor transmission line structure created on a dielectric substrate member which confines the probing field within a sharply defined sampling volume in the material under study. A method for manufacturing dielectric support member based probes includes anisotropically depositing a 50-100 Å thick underlayer of Cr, Ni, W or Ta onto the dielectric support member, anisotropically depositing conductive material onto the Cr, Ni, W or Ta underlayer, and removing the unwanted conductive material at the sides of the dielectric support member to electrically isolate the created conductive strips.