Patents by Inventor Andrew S. Hoadley

Andrew S. Hoadley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleaning of semiconductor wafers by contaminate encapsulation
    Patent number: 7531059
    Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: May 12, 2009
    Assignee: International Business Machines Corporation
    Inventors: Nicole S Carpenter, Joseph R Drennan, Alison K Easton, Casey J Grant, Andrew S Hoadley, Kenneth F McAvey, Jr., Joel M Sharrow, William A Syverson, Kenneth H Yao
  • Cleaning of semiconductor wafers by contaminate encapsulation
    Publication number: 20040169012
    Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.
    Type: Application
    Filed: March 10, 2004
    Publication date: September 2, 2004
    Applicant: International Business Machines Corporation
    Inventors: Nicole S. Carpenter, Joseph R. Drennan, Alison K. Easton, Casey J. Grant, Andrew S. Hoadley, Kenneth F. McAvey, Joel M. Sharrow, William A. Syverson, Kenneth H. Yao
  • Cleaning of semiconductor wafers by contaminate encapsulation
    Patent number: 6776171
    Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: August 17, 2004
    Assignee: International Business Machines Corporation
    Inventors: Nicole S. Carpenter, Joseph R. Drennan, Alison K. Easton, Casey J. Grant, Andrew S. Hoadley, Kenneth F. McAvey, Jr., Joel M. Sharrow, William A. Syverson, Kenneth H. Yao
  • Cleaning of semiconductor wafers by contaminate encapsulation
    Publication number: 20030000547
    Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.
    Type: Application
    Filed: June 27, 2001
    Publication date: January 2, 2003
    Applicant: International Business Machines Corporation
    Inventors: Nicole S. Carpenter, Joseph R. Drennan, Alison K. Easton, Casey J. Grant, Andrew S. Hoadley, Kenneth F. McAvey, Joel M. Sharrow, William A. Syverson, Kenneth H. Yao