Patents by Inventor Andrew S. Menz

Andrew S. Menz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lapping head with a sensor device on the rotating lapping head
    Patent number: 9308622
    Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: April 12, 2016
    Assignee: Seagate Technology LLC
    Inventors: Leping Li, Andrew S. Menz, John F. Schmidt, Stephen J. Mackin
  • Lapping Head with a Sensor Device on the Rotating Lapping Head
    Publication number: 20150111468
    Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Inventors: Leping Li, Andrew S. Menz, John F. Schmidt, Stephen J. Mackin