Patents by Inventor Andrew Sherve

Andrew Sherve has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230311268
    Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
    Type: Application
    Filed: May 19, 2023
    Publication date: October 5, 2023
    Inventors: Edwin Rejda, Andrew Habermas, Jeff O'Konski, Andrew Sherve, Michael Thomas Johnson, Dongming Liu
  • Patent number: 11691242
    Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: July 4, 2023
    Assignee: Seagate Technology LLC
    Inventors: Edwin Rejda, Andrew Habermas, Jeff O'Konski, Andrew Sherve, Michael Thomas Johnson, Dongming Liu
  • Publication number: 20220234166
    Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
    Type: Application
    Filed: April 14, 2022
    Publication date: July 28, 2022
    Inventors: Edwin Rejda, Andrew Habermas, Jeff O'Konski, Andrew Sherve, Michael Thomas Johnson, Dongming Liu
  • Patent number: 11389924
    Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: July 19, 2022
    Assignee: Seagate Technology LLC
    Inventors: Edwin Rejda, Andrew Habermas, Jeff O'Konski, Andrew Sherve, Michael Thomas Johnson, Dongming Liu
  • Patent number: 11331765
    Abstract: The present disclosure includes methods and systems that include multiple lapping stages having at least one lapping stage that laps while a heat source is applied to cause expansion during lapping and at least one subsequent lapping stage that laps while the heat source is reduced (e.g., turned off).
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: May 17, 2022
    Assignee: Seagate Technology LLC
    Inventors: Andrew Sherve, Neil Zuckerman, Vasudevan Ramaswamy, Andrew Habermas
  • Patent number: 11037586
    Abstract: The present disclosure includes methods and systems for lapping a row bar of sliders. According to the present disclosure, an electrical interconnect configuration is provided that permits the net current provided to a row bar to heat electrical heating devices during lapping to be managed so as help prevent exceeding breakdown currents of related electrical channels.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: June 15, 2021
    Assignee: Seagate Technology LLC
    Inventors: Andrew Sherve, Jeff O'Konski, Yuhong Xiong, Andrew Habermas
  • Publication number: 20190381629
    Abstract: The present disclosure includes methods of lapping that include energizing one or more elements that are located proximal to a first magnetoresistive element in a transducer region and generate heat and cause the first magnetoresistive element to selectively expand in the lapping direction relative to one or more other magnetoresistive elements. The present disclosure also includes methods of lapping that use one or more thermal sensors located proximal to the first magnetoresistive element to help control lapping in the lapping direction. The present disclosure includes related lapping systems and sliders.
    Type: Application
    Filed: June 7, 2019
    Publication date: December 19, 2019
    Inventors: Edwin Rejda, Andrew Habermas, Jeff O'Konski, Andrew Sherve, Michael Thomas Johnson, Dongming Liu