Patents by Inventor Andrew Stemmermann

Andrew Stemmermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitors from magnetic particles
    Patent number: 12738420
    Abstract: Compositions and methods for creating in situ capacitors, micro-capacitors, battery like applications, and chipless memory chips are provided. The methods and compositions all comprise the use of magnetically-alignable particles. In various applications herein the particles may be nonconductive, in another aspect, the particles are conductive. The functional capacitors entail the ferromagnetic particles and a dielectric material or a non-conductive coating.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: September 15, 2026
    Assignee: SunRay Scientific, Inc.
    Inventor: Andrew Stemmermann
  • Method for creating interconnections between a substrate and electronic components
    Patent number: 12543270
    Abstract: Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
    Type: Grant
    Filed: February 12, 2023
    Date of Patent: February 3, 2026
    Inventor: Andrew Stemmermann
  • SYSTEM FOR CREATING INTERCONNECTIONS BETWEEN A SUBSTRATE AND ELECTRONIC COMPONENTS
    Publication number: 20230189449
    Abstract: Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
    Type: Application
    Filed: February 12, 2023
    Publication date: June 15, 2023
    Inventor: Andrew Stemmermann
  • System for creating interconnections between a substrate and electronic components
    Patent number: 11606864
    Abstract: Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: March 14, 2023
    Assignee: SunRay Scientific, Inc.
    Inventor: Andrew Stemmermann
  • THERMAL MANAGEMENT FOR ELECTRONICS USING NONCONDUCTIVE MAGNETIC PARTICLES
    Publication number: 20210222043
    Abstract: Compositions for thermal interface materials comprising magnetically-alignable, thermally-conductive, electrically-nonconductive particles in a matrix comprising curable polymers are provided. The compositions are also useful for use as heat sinks. Methods are provided for the use of such compounds for thermal management and heat dissipation in the electronics industry.
    Type: Application
    Filed: January 21, 2021
    Publication date: July 22, 2021
    Applicant: SunRay Scientific, Inc.
    Inventor: Andrew Stemmermann
  • Capacitors From Magnetic Particles
    Publication number: 20210175015
    Abstract: Compositions and methods for creating in situ capacitors, micro-capacitors, battery like applications, and chipless memory chips are provided. The methods and compositions all comprise the use of magnetically-alignable particles. In various applications herein the particles may be nonconductive, in another aspect, the particles are conductive. The functional capacitors entail the ferromagnetic particles and a dielectric material or a non-conductive coating.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 10, 2021
    Applicant: SunRay Scientific, LLC
    Inventor: Andrew Stemmermann
  • SYSTEM AND METHOD FOR IMPROVED ELECTRONIC COMPONENT INTERCONNECTIONS
    Publication number: 20200163225
    Abstract: Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
    Type: Application
    Filed: November 15, 2018
    Publication date: May 21, 2020
    Applicant: SunRay Scientific, LLC
    Inventor: Andrew Stemmermann