Patents by Inventor Andrew Stentz

Andrew Stentz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pumping arrangement for fiber amplifiers with reduced reflective feedback
    Publication number: 20070003196
    Abstract: An improved tapered fiber bundle (TFB), or assembly including a TFB, mitigates undesirable reflections from optical discontinuities at the input ends of the multimode fibers of the TFB by suppressing the coupling of signal light into modes that can produce undesired reflections. Means are provided for managing the mode field of injected signal light so that it remains substantially confined to the core of the central TFB fiber until it is past the region where it can interact with the multimode fibers of the TFB.
    Type: Application
    Filed: June 29, 2005
    Publication date: January 4, 2007
    Inventors: Douglas Holcomb, Andrew Stentz, Stephan Wielandy, Paul Wysocki