Abstract: Tissue access devices and methods of using the same are disclosed. The devices can have a sensor configured to occlude a flow path by deflecting a membrane into the flow path when the devices become dislodged from tissue. The sensor can be configured to partially or fully occlude the flow path. The sensor can have a spring. The spring can be biased to move the sensor from a sensor first configuration to a sensor second configuration when a force applied by the sensor first surface against a non-sensor surface changes from a first force to a second force less than the first force. The membrane can be deflected into the flow path when the sensor is in the sensor second configuration.

Abstract: A sensor device for testing electrical connections using contactless fault detection is disclosed. The sensor device includes: a surface coil comprising a plurality of concentric loops disposed at a first region located away from the electrical connections. The concentric loops generate a first magnetic field passing through the electrical connections, and the first magnetic field is equivalent to that generated by a coaxial intermediate current loop adjacent to the electrical connections based on an excitation current in the surface coil. The sensor device further includes a sensor adapted to detect a second magnetic field at a second region located away from the electrical connections, wherein variations in the detected second magnetic field provide categories of performance of the electrical connections.

Abstract: A sensor device is provided for detecting electrical defects in a device under test (DUT). The sensor device includes a signal line configured to conduct a stimulus signal through a first conductor in the DUT; an inductor connected in series with the signal line for providing an inductance; and a ground line arranged adjacent to the signal line and configured to provide a ground path through a second conductor in the DUT for the stimulus signal conducted through the signal line and the first conductor. A resonance frequency for the signal line is determined based on the inductance and an effective capacitance of the signal line generated in response to the stimulus signal. An increase in the resonance frequency indicates an open defect in the first conductor and/or the second conductor, and a decrease in the resonance frequency indicates a short defect between the first conductor and the second conductor.

Abstract: Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.

Abstract: Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.