Patents by Inventor Andrew Thom

Andrew Thom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11890484
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: February 6, 2024
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Publication number: 20230372905
    Abstract: The present disclosure relates to oxidation catalyst compositions for use in a close-coupled diesel oxidation catalyst (ccDOC) application, in which the ccDOC can function as a heat generator under high space velocity conditions. The oxidation catalyst compositions include a high surface area support material doped with at least one metal oxide, and a platinum group metal (PGM) supported on the doped high surface area support material.
    Type: Application
    Filed: October 15, 2021
    Publication date: November 23, 2023
    Inventors: M. Shahjahan Kazi, Shiang Sung, Claire Chunjuan Zhang, Xiaolai Zheng, Sandip D. Shah, Andrew Thoms
  • Publication number: 20230127724
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 27, 2023
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Patent number: 11559695
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: January 24, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Patent number: 11268420
    Abstract: A system for treatment of an exhaust gas stream from an engine is provided, containing an upstream selective catalytic reduction (SCR) catalyst, which receives the exhaust gas stream without any intervening catalyst, a diesel oxidation catalyst (DOC) positioned downstream thereof; a catalyzed soot filter (CSF) downstream of the diesel oxidation catalyst; a second SCR catalyst positioned downstream of the catalyzed soot filter; and an ammonia oxidation (AMOx) catalyst. The application also describes use of such systems to reduce nitrogen oxides (NOx) and hydrocarbons (HC) in an exhaust gas stream.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: March 8, 2022
    Assignee: BASF Corporation
    Inventors: Kenneth E. Voss, Kevin A. Hallstrom, Sandip D. Shah, David M. Youngren, Andrew Thoms, M. Shahjahan Kazi, Robert Dorner
  • Publication number: 20210178168
    Abstract: Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 17, 2021
    Inventors: Darren A. Janzig, Andrew Thom, Brad Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead
  • Publication number: 20210079826
    Abstract: A system for treatment of an exhaust gas stream from an engine is provided, containing an upstream selective catalytic reduction (SCR) catalyst, which receives the exhaust gas stream without any intervening catalyst, a diesel oxidation catalyst (DOC) positioned downstream thereof; a catalyzed soot filter (CSF) downstream of the diesel oxidation catalyst; a second SCR catalyst positioned downstream of the catalyzed soot filter; and an ammonia oxidation (AMOx) catalyst. The application also describes use of such systems to reduce nitrogen oxides (NOx) and hydrocarbons (HC) in an exhaust gas stream.
    Type: Application
    Filed: February 18, 2019
    Publication date: March 18, 2021
    Inventors: Kenneth E. Voss, Kevin A. Hallstrom, Sandip D. Shah, David M. Youngren, Andrew Thoms, M. Shahjahan Kazi, Robert Dorner
  • Patent number: 10471266
    Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO2, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: November 12, 2019
    Assignees: MEDTRONIC, INC., KYOCERA CORPORATION
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20160317821
    Abstract: A method of manufacturing an implantable medical device includes manufacturing a hermetic feedthrough by providing a first sheet of unfired ceramic material, forming one or more holes through the sheet, inserting a first conductive material into one of the holes, and forming a pad in electrical contact with the first conductive material in one of the holes, wherein the pad comprises a plurality of layers and has a thickness of at least 50 micrometers, at least one layer comprising a second conductive material having a different composition than the first conductive material. The method further includes co-firing the unfired ceramic material, the first conductive material, and the second conductive material. The method further includes coupling the feedthrough to an encasement structure of the implantable medical device.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Applicants: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 9418778
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: August 16, 2016
    Assignees: MEDTRONIC, INC., KYOCERA CORPORATION
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 9008779
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: April 14, 2015
    Assignees: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8872035
    Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: October 28, 2014
    Assignees: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto, Takahito Hirata
  • Publication number: 20140305694
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Application
    Filed: March 10, 2014
    Publication date: October 16, 2014
    Applicants: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8841558
    Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: September 23, 2014
    Assignees: Medtronic Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20140151114
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.
    Type: Application
    Filed: February 7, 2014
    Publication date: June 5, 2014
    Applicants: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8670829
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: March 11, 2014
    Assignees: Medtronic, Inc., Kyocera Corporation
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Patent number: 8588916
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: November 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20130032382
    Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto
  • Publication number: 20130032378
    Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Andrew Thom, Hiroshi Makino, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto, Takahito Hirata
  • Publication number: 20130032392
    Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Kengo Morioka, Keiichi Fujii, Arne Knudsen, Shingo Satou, Hidekazu Otomaru, Hiroshi Makino, Andrew Thom, Markus Reiterer, Gordon Munns, Thomas Miltich, Joyce Yamamoto