Patents by Inventor Andrew Thomas BARFKNECHT

Andrew Thomas BARFKNECHT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer lid wafer-level package with an electrically and thermally conductive pillar
    Patent number: 10804875
    Abstract: An apparatus include a device substrate having an upper surface, and a frame layer having an upper surface. The frame layer is disposed over the upper surface of the device substrate, and a first opening exists in the frame layer. The apparatus also includes a seed layer disposed over the device substrate and substantially bounded by the first opening; and a lid layer having an upper surface. The lid layer is disposed over the upper surface of the frame layer. A second opening exists in the lid layer, and the second opening is aligned with the first opening. The apparatus also includes an electrically and thermally conductive pillar disposed in the first opening and the second opening.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: October 13, 2020
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Stephen Roy Gilbert, Martin Franosch, Suresh Sridaran, Andrew Thomas Barfknecht, Richard C. Ruby
  • POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY CONDUCTIVE PILLAR
    Publication number: 20190103852
    Abstract: An apparatus include a device substrate having an upper surface, and a frame layer having an upper surface. The frame layer is disposed over the upper surface of the device substrate, and a first opening exists in the frame layer. The apparatus also includes a seed layer disposed over the device substrate and substantially bounded by the first opening; and a lid layer having an upper surface. The lid layer is disposed over the upper surface of the frame layer. A second opening exists in the lid layer, and the second opening is aligned with the first opening. The apparatus also includes an electrically and thermally conductive pillar disposed in the first opening and the second opening.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Stephen Roy Gilbert, Martin Franosch, Suresh Sridaran, Andrew Thomas Barfknecht, Richard C. Ruby
  • Packaged device including cavity package with elastic layer within molding compound
    Patent number: 9680445
    Abstract: A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: June 13, 2017
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Andrew Thomas Barfknecht, Klaus-Guenter Oppermann
  • PACKAGED DEVICE INCLUDING CAVITY PACKAGE WITH ELASTIC LAYER WITHIN MOLDING COMPOUND
    Publication number: 20160126443
    Abstract: A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.
    Type: Application
    Filed: October 31, 2014
    Publication date: May 5, 2016
    Inventors: Andrew Thomas Barfknecht, Klaus-Guenter Oppermann
  • SURFACE PASSIVATION OF SUBSTRATE BY MECHANICALLY DAMAGING SURFACE LAYER
    Publication number: 20150014795
    Abstract: An apparatus comprises a substrate having a trap rich surface layer produced by mechanically grinding a surface of the substrate, an electrical contact disposed on the trap rich surface layer of the substrate, and an electronic device electrically connected to the electrical contact.
    Type: Application
    Filed: July 10, 2013
    Publication date: January 15, 2015
    Inventors: Martin FRANOSCH, Andrew Thomas BARFKNECHT