Patents by Inventor Andrew Tohmc

Andrew Tohmc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-voltage and low-voltage signaling output driver
    Patent number: 10707876
    Abstract: A hybrid output driver is disclosed that supports high-voltage signaling and low-voltage signaling. The high-voltage signaling is powered by a high-power supply voltage that is greater than a low-power supply voltage that powers the low-voltage signaling.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: July 7, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Young Uk Yim, Jacob Schneider, Satish Krishnamoorthy, Mohammed Mizanur Rahman, Prince Mathew, Andrew Tohmc, Chang Ki Kwon, Ashwin Sethuram, Mostafa Naguib Abdulla
  • High-voltage and low-voltage signaling output driver
    Patent number: 10666263
    Abstract: A hybrid output driver is disclosed that supports high-voltage signaling and low-voltage signaling. The high-voltage signaling is powered by a high-power supply voltage that is greater than a low-power supply voltage that powers the low-voltage signaling.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: May 26, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Young Uk Yim, Jacob Schneider, Satish Krishnamoorthy, Mohammed Mizanur Rahman, Prince Mathew, Andrew Tohmc, Chang Ki Kwon, Ashwin Sethuram, Mostafa Naguib Abdulla
  • Programmable pad capacitance for supporting bidirectional signaling from unterminated endpoints
    Patent number: 9767889
    Abstract: A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: September 19, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Scott Powers, Thomas Bryan, Andrew Tohmc, Subrahmanya Pradeep Morusupalli, Tin Tin Wee, Kenneth Dubowski