Patents by Inventor Andrew V. Kearney

Andrew V. Kearney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a semiconductor package with integrated substrate thermal slug
    Patent number: 8623707
    Abstract: To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: January 7, 2014
    Assignee: Cisco Technology, Inc.
    Inventors: Andrew V. Kearney, Peng Su
  • Semiconductor package with integrated substrate thermal slug
    Patent number: 8405203
    Abstract: To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: March 26, 2013
    Assignee: Cisco Technology, Inc.
    Inventors: Andrew V. Kearney, Peng Su
  • SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG
    Publication number: 20120063096
    Abstract: To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 15, 2012
    Inventors: Andrew V. Kearney, Peng Su