Patents by Inventor Andrew V. MAZUR

Andrew V. MAZUR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128253
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Inventors: Denis MYASISHCHEV, Andrew V. MAZUR, Purushotham Kaushik MUTHUR SRINATH, Robert M. NICKERSON, Shripad GOKHALE
  • Publication number: 20210066273
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Denis MYASISHCHEV, Andrew V. MAZUR, Purushotham Kaushik MUTHUR SRINATH, Robert M. NICKERSON, Shripad GOKHALE