Patents by Inventor Andrew W. Batchelor

Andrew W. Batchelor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat exchanger for an electronic heat pump
    Patent number: 6619044
    Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: September 16, 2003
    Assignee: Hydrocool Pyt, Limited
    Inventors: Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke
  • Heat exchanger for an electronic heat pump
    Publication number: 20020184894
    Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
    Type: Application
    Filed: July 26, 2002
    Publication date: December 12, 2002
    Inventors: Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke
  • Heat exchanger for an electronic heat pump
    Patent number: 6446442
    Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: September 10, 2002
    Assignee: Hydrocool Pty Limited
    Inventors: Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke