Abstract: A case for an electronic device can include a case body including an exterior surface and an interior surface, the interior surface being positioned opposite the exterior surface. The case can additionally include a button body positioned at least partially within the case body between the exterior surface and the interior surface, the button body being movable inward and outward relative to the case body along an axis of button travel. The case can further include a biasing structure having a contact surface configured to contact the button body, the biasing structure configured to bias the button body toward the interior surface along the axis of button travel.

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The display and the housing can define an internal volume and a speaker assembly can be positioned in the internal volume. The speaker assembly can include a speaker enclosure sealed to the housing within the internal volume, the speaker enclosure and the housing defining a speaker volume, and a speaker module in fluid communication with the speaker volume, the speaker module including a diaphragm positioned at an aperture defined by the speaker volume, the diaphragm defining multiple ridges.

Abstract: A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.

Abstract: A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The display and the housing can define an internal volume and a speaker assembly can be positioned in the internal volume. The speaker assembly can include a speaker enclosure sealed to the housing within the internal volume, the speaker enclosure and the housing defining a speaker volume, and a speaker module in fluid communication with the speaker volume, the speaker module including a diaphragm positioned at an aperture defined by the speaker volume, the diaphragm defining multiple ridges.

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.

Abstract: A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.