Patents by Inventor Andrew Wallmueller

Andrew Wallmueller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal processing system and method of using
    Patent number: 8341819
    Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.
    Type: Grant
    Filed: July 1, 2012
    Date of Patent: January 1, 2013
    Assignee: Tokyo Electron Limited
    Inventor: Andrew Wallmueller
  • THERMAL PROCESSING SYSTEM AND METHOD OF USING
    Publication number: 20120266425
    Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.
    Type: Application
    Filed: July 1, 2012
    Publication date: October 25, 2012
    Applicant: Tokyo Electron Limited
    Inventor: Andrew WALLMUELLER
  • Thermal processing system and method of using
    Patent number: 8209833
    Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: July 3, 2012
    Assignee: Tokyo Electron Limited
    Inventor: Andrew Wallmueller
  • Thermal Processing System and Method of Using
    Publication number: 20100119337
    Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.
    Type: Application
    Filed: November 7, 2008
    Publication date: May 13, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Andrew Wallmueller