Patents by Inventor Andrew Willner

Andrew Willner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9909947
    Abstract: In an embodiment, a pressure sensor includes a tip secured to a port. The tip includes an opening for receiving pressure to be measured by the pressure sensor. The port includes a threaded section for mounting the pressure sensor in a fixture such as, for example, a rail. The port also includes a flexible section, a cavity, and an opening. The opening in the tip receives pressure from an outside source and channels the pressure to the opening of the port. The opening of the port receives the pressure from the tip and channels the pressure to the cavity. The pressure received in the cavity applies a force to the flexible section which flexes in response to the force. Moreover, forces are provided by the tip and the threaded section to keep the tip secured to the port.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: March 6, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Calvin S. Reuter, Ernie Schoot Uiterkamp, Daniel Goncalves, Andrew Willner, Mark McBrine, Prasanth Ambady
  • Publication number: 20170138809
    Abstract: In an embodiment, a pressure sensor includes a tip secured to a port. The tip includes an opening for receiving pressure to be measured by the pressure sensor. The port includes a threaded section for mounting the pressure sensor in a fixture such as, for example, a rail. The port also includes a flexible section, a cavity, and an opening. The opening in the tip receives pressure from an outside source and channels the pressure to the opening of the port. The opening of the port receives the pressure from the tip and channels the pressure to the cavity. The pressure received in the cavity applies a force to the flexible section which flexes in response to the force. Moreover, forces are provided by the tip and the threaded section to keep the tip secured to the port.
    Type: Application
    Filed: November 13, 2015
    Publication date: May 18, 2017
    Inventors: Calvin S. Reuter, Ernie Schoot Uiterkamp, Daniel Goncalves, Andrew Willner, Mark McBrine, Prasanth Ambady
  • Patent number: 9312610
    Abstract: In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: April 12, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: Andrew Willner, Giovanni Fraone, Dedde Hedzer Wiersma, Andrew LeGendre, Raymond E. Mandeville, Shuo Robert Chen, Ted Medeiros, Matt Nelson
  • Publication number: 20150072543
    Abstract: In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 12, 2015
    Inventors: Andrew Willner, Giovanni Fraone, Hedzer Wiersma, Andrew LeGendre, Raymond E. Mandeville, Shuo Robert Chen, Ted Medeiros, Matt Nelson
  • Patent number: 7578194
    Abstract: A differential liquid pressure sensor (10) has an upper housing (12) that mounts a connector portion (12a) and receives in a recess a sense element module (14). The sense element module is a body in which a generally U-shaped oil filled passageway (14h) is formed with openings at opposite ends provided on respective first and second diaphragm mounting surfaces. A fluid pressure sense element, such as a piezoresistive sense element (15) is disposed in one of the passageway openings and flexible metal diaphragms (14a, 14b) are mounted on the respective diaphragm mounting surfaces of the module facing a common direction. A lower housing (18) having first and second port connections for the respective diaphragms is disposed on the lower surface of the module.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: August 25, 2009
    Assignee: Sensata Technologies, Inc.
    Inventors: Costas Hadjiloucas, Andrew Willner, Andrew Amatruda, George Krajewski
  • Publication number: 20090199647
    Abstract: A differential liquid pressure sensor (10) has an upper housing (12) that mounts a connector portion (12a) and receives in a recess a sense element module (14). The sense element module is a body in which a generally U-shaped oil filled passageway (14h) is formed with openings at opposite ends provided on respective first and second diaphragm mounting surfaces. A fluid pressure sense element, such as a piezoresistive sense element (15) is disposed in one of the passageway openings and flexible metal diaphragms (14a, 14b) are mounted on the respective diaphragm mounting surfaces of the module facing a common direction. A lower housing (18) having first and second port connections for the respective diaphragms is disposed on the lower surface of the module.
    Type: Application
    Filed: February 11, 2008
    Publication date: August 13, 2009
    Inventors: Costas Hadjiloucas, Andrew Willner, Andrew Amatruda, George Krajewski
  • Publication number: 20060162461
    Abstract: A pressure sensing device (10, 40) is shown having a ceramic capacitive sensing element (12) received in a chamber formed in a hexport housing (16). The hexport housing has a fluid passageway (16c) communicating with a recessed chamber (16d) formed in a bottom wall circumscribed by an annular platform shoulder (16e). A thin flexible metal diaphragm (18) is hermetically attached to the bottom wall along the platform shoulder. A curable adhesive resin having a thermal coefficient of expansion and modulus of elasticity appropriately matching that of sensing element (12), such as polyurethane, is cast between the sensing element (12) and the metal diaphragm (18) forming, when cured, a layer bonded to both members resulting in a sensor that is effective in monitoring negative as well as positive fluid pressures.
    Type: Application
    Filed: January 17, 2006
    Publication date: July 27, 2006
    Inventors: Alan Amore, Eric Giasson, James Ogilvie, Stephen Greene, David Field, Andrew Willner, Vanvisa Attaset