Patents by Inventor Andrew Yaung

Andrew Yaung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090260862
    Abstract: An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and electrically couple to a lead of an electrical component. At least one masking layer is positioned to electrically isolate the plurality of electrically-conductive traces, one from another.
    Type: Application
    Filed: April 16, 2008
    Publication date: October 22, 2009
    Inventors: Andrew Yaung, Neal S. Greenberg
  • Publication number: 20090250246
    Abstract: An electronic circuit assembly comprises a printed circuit board including a plurality of electrically-conductive traces disposed on at least one face of the printed circuit board and a circuit schematic layout. The plurality of electrically-conductive traces is configured to mount and electrically couple a plurality of types of electronic devices. The circuit schematic layout includes a map arranged similarly to the layout of the plurality of electrically-conductive traces disposed on the at least one face of the printed circuit board. A plurality of layout column markers and a plurality of layout row markers and a plurality of color-coded regions are marked directly onto the map. Each color of the plurality of color-coded regions is indicative of a particular one of the plurality of types of electronic devices.
    Type: Application
    Filed: April 7, 2008
    Publication date: October 8, 2009
    Inventors: Andrew Yaung, Neal S. Greenberg
  • Patent number: 7511228
    Abstract: A printed circuit board including a substrate, a plurality of traces on the substrate and a solder mask over the conductive traces. Apertures in the mask expose a plurality of connective pads on the substrate. The mask creates grooves which surround the mounting pads.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: March 31, 2009
    Assignee: Schmartboard, Inc.
    Inventors: Andrew Yaung, Neal S. Greenberg
  • Patent number: 7203074
    Abstract: Electronic Circuit Building Blocks are mechanically connected to each other to form larger circuit boards using a mechanical bridge connector. The Electronic Circuit Building Blocks include female interlocking elements formed on its edges, and the mechanical bridge connector includes male interlocking elements. Half parts of the male interlocking elements of the mechanical bridge connector are inserted into the corresponding female interlocking elements of the Electronic Circuit Building Blocks from one side of the circuit board. The Electronic Circuit Building Blocks include through-holes for mounting through-hole components and/or surface-mount pads for mounting surface-mount components. The Electronic Circuit Building Blocks also include traces interconnecting two or more of the through-hole components and the surface-mount components.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: April 10, 2007
    Assignee: Intellect Lab, LLC
    Inventors: Andrew Yaung, Neal S. Greenberg, Che Wai Yeung
  • Publication number: 20070056765
    Abstract: A printed circuit board including a substrate, a plurality of traces on the substrate and a solder mask over the conductive traces. Apertures in the mask expose a plurality of connective pads on the substrate. The mask creates grooves which surround the mounting pads.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 15, 2007
    Inventors: Andrew Yaung, Neal Greenberg