Abstract: A direct thermoelectrochemical heat-to-electricity converter includes two electrochemical cells at hot and cold temperatures, each having a gas-impermeable, electron-blocking membrane capable of transporting an ion I, and a pair of electrodes on opposite sides of the membrane. Two closed-circuit chambers A and B each includes a working fluid, a pump, and a counter-flow heat exchanger. The chambers are connected to opposite sides of the electrochemical cells and carry their respective working fluids between the two cells. The working fluids are each capable of undergoing a reversible redox half-reaction of the general form R?O+I+e?, where R is a reduced form of an active species in a working fluid and O is the oxidized forms of the active species. One of the first pair of electrodes is electrically connected to one the second pair of electrodes via an electrical load to produce electricity.

Abstract: A direct thermoelectrochemical heat-to-electricity converter includes two electrochemical cells at hot and cold temperatures, each having a gas-impermeable, electron-blocking membrane capable of transporting an ion I, and a pair of electrodes on opposite sides of the membrane. Two closed-circuit chambers A and B each includes a working fluid, a pump, and a counter-flow heat exchanger. The chambers are connected to opposite sides of the electrochemical cells and carry their respective working fluids between the two cells. The working fluids are each capable of undergoing a reversible redox half-reaction of the general form R?O+I+e?, where R is a reduced form of an active species in a working fluid and O is the oxidized forms of the active species. One of the first pair of electrodes is electrically connected to one the second pair of electrodes via an electrical load to produce electricity.

Abstract: A heterojunction semiconductor device including an array of microstructures, each microstructure including a microwire of a first semiconductor material and a coating of a second semiconductor material forming a heterojunction with the microwire; a first electrical contact and a second electrical contact, one of which is connected to the microwire and the other of which is connected to the coating, is described. Also described are considerations for configuring the array of microstructures, and methods of forming the array of microstructures.