Patents by Inventor Andrey Denisyuk

Andrey Denisyuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210050180
    Abstract: A device for creating and placing a lamella comprises a focused ion beam, a scanning electron microscope, a stage for placing at least two specimens enabling tilting, rotation and movement of the specimen. The device further comprises a manipulator terminated by a needle for attaching and transporting the specimen. The manipulator is positioned in a plane perpendicular to the axis of the tilt of the specimen, thereby enabling easy transportation and placing of the lamella into the specimen holder for a transmission electron microscope, so-called grid. The manipulator is adjusted to rotate the needle about its own axis. Thus, it enables inverting of the lamella and its polishing over a layer of semiconductor substrate, on which a semiconductor structure is formed, in case of creating the lamella from a semiconductor device.
    Type: Application
    Filed: March 29, 2019
    Publication date: February 18, 2021
    Applicants: Tescan Brno, s.r.o., Tescan Orsay Holding, A.S.
    Inventors: Andrey Denisyuk, Pavel Dolezel
  • Patent number: 10832918
    Abstract: A method of uniformly removing material from a sample surface includes the steps of sputtering by means of scanning the surface with a focused ion beam and a simultaneous observing of the sample during sputtering. Uniform sputtering of different materials is achieved by high-angle sputtering from multiple directions, wherein the directions are rotated relative to each other by a non-zero angle.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 10, 2020
    Assignees: Tescan Brno, s.r.o., Tescan.Orsay Holding A.S.
    Inventors: Andrey Denisyuk, Sharang Sharang, Jozef Vincenc Obona
  • Publication number: 20190074184
    Abstract: The subject matter of the invention is a method of uniformly removing material from a sample surface by sputtering by means of scanning the surface with a focused ion beam and a simultaneous observing of the sample during sputtering. Uniform sputtering of different materials is achieved by high-angle sputtering from multiple directions, wherein the directions are rotated relative to each other by a non-zero angle.
    Type: Application
    Filed: July 25, 2018
    Publication date: March 7, 2019
    Applicants: TESCAN Brno, s.r.o., TESCAN ORSAY HOLDING a.s.
    Inventors: Andrey Denisyuk, Sharang Sharang, Vincenc Jozef Obona