Abstract: Methods of forming Luneburg lenses and Luneburg lenses formed from same are provided. One method includes providing a spherical core formed of a material with a substantially uniform dielectric constant from a center of the spherical core to an outer surface of the spherical core. The method further includes forming a plurality of holes that are substantially uniform in size and symmetrically located about the center of the spherical core. The method further includes forming an at least one outer layer that is substantially spherical by winding a filament formed of a low-loss material around the spherical core.

Abstract: Multi-beam uniform coverage in a coverage cell(s) in a wireless communications system (WCS) is provided. The WCS includes a number of wireless devices that are typically mounted on a fixed structure to provide coverage for user devices. Each wireless device includes one or more antenna arrays. Each antenna array is controlled via a set of codewords to form one or more RF beams to each cover a respective area in a coverage cell. The codewords are predetermined based on fairness and/or leakage constraints such that the RF beams can be formed in desired geometric shapes and steered toward desired directions to provide a uniform coverage in the coverage cell. By forming the RF beams based on the codewords predetermined based on fairness and/or leakage constraints, it is possible to ensure an equal RF power signal level inside the coverage cell and/or reduced power leakage outside the coverage cell.

Abstract: A method of laser bonding glass ceramic to metal foil includes contacting a first surface of a first glass ceramic substrate with a first surface of a first metal foil to create a first contact location between at least a portion of the first surface of the first glass ceramic substrate and the first surface of the first metal foil; and conducting a first welding step by directing a laser beam on at least a portion of the first contact location to bond the first glass ceramic substrate to the first metal foil and form a first bond location and a package. The first glass ceramic substrate has a thickness greater than or equal to 20 ?m and less than or equal to 250 ?m. The laser beam comprises a pulsed laser comprising a wavelength greater than or equal to 250 nm and less than or equal to 2 ?m.

Abstract: Methods of forming Luneburg lenses and Luneburg lenses formed from same are provided. One method includes providing a spherical core formed of a material with a substantially uniform dielectric constant from a center of the spherical core to an outer surface of the spherical core. The method further includes forming a plurality of holes that are substantially uniform in size and symmetrically located about the center of the spherical core. The method further includes forming an at least one outer layer that is substantially spherical by winding a filament formed of a low-loss material around the spherical core.

Abstract: Multi-beam uniform coverage in a coverage cell(s) in a wireless communications system (WCS) is provided. The WCS includes a number of wireless devices that are typically mounted on a fixed structure to provide coverage for user devices. Each wireless device includes one or more antenna arrays. Each antenna array is controlled via a set of codewords to form one or more RF beams to each cover a respective area in a coverage cell. The codewords are predetermined based on fairness and/or leakage constraints such that the RF beams can be formed in desired geometric shapes and steered toward desired directions to provide a unform coverage in the coverage cell. By forming the RF beams based on the codewords predetermined based on fairness and/or leakage constraints, it is possible to ensure an equal RF power signal level inside the coverage cell and/or reduced power leakage outside the coverage cell.

Abstract: A multi-operator radio node for a communication system that supports sharing a common antenna array while supporting multiple service providers. The multi-operator radio node includes signal processing circuits for each supported service provider. Each signal processing circuit is configured to receive communication signals for a supported service provider to be distributed through a common antenna array to wireless client devices. Each signal processing circuit includes a modem that processes the received communication signals for spectrum of its service provider to provide signal streams to be distributed to co-located antenna elements in the antenna array. Summation circuits are provided at the front end of each RF chain circuit to combine signal streams of the spectrum of the service providers directed to the same antenna element in the antenna array to form signal beams in individual frequencies of the service providers.

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

Abstract: A multi-operator radio node for a communication system that supports sharing a common antenna array while supporting multiple service providers. The multi-operator radio node includes signal processing circuits for each supported service provider. Each signal processing circuit is configured to receive communication signals for a supported service provider to be distributed through a common antenna array to wireless client devices. Each signal processing circuit includes a modem that processes the received communication signals for spectrum of its service provider to provide signal streams to be distributed to co-located antenna elements in the antenna array. Summation circuits are provided at the front end of each RF chain circuit to combine signal streams of the spectrum of the service providers directed to the same antenna element in the antenna array to form signal beams in individual frequencies of the service providers.

Abstract: A method for forming lenses for a fiber optic connector includes forming a mask on a photosensitive glass, the mask defining a plurality of covered portions of the photosensitive glass and a plurality of open portions of the photosensitive glass that are positioned between the plurality of covered portions, exposing the photosensitive glass and the mask to electromagnetic energy, removing the mask from the photosensitive glass, forming wafer-level lenses at the plurality of covered portions of the photosensitive glass by exposing the photosensitive glass to thermal energy, and applying an anti-reflective coating to an upper surface of the photosensitive glass.

Abstract: A method for forming lenses for a fiber optic connector includes forming a mask on a photosensitive glass, the mask defining a plurality of covered portions of the photosensitive glass and a plurality of open portions of the photosensitive glass that are positioned between the plurality of covered portions, exposing the photosensitive glass and the mask to electromagnetic energy, removing the mask from the photosensitive glass, forming wafer-level lenses at the plurality of covered portions of the photosensitive glass by exposing the photosensitive glass to thermal energy, and applying an anti-reflective coating to an upper surface of the photosensitive glass.

Abstract: Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device are disclosed. Interposer assemblies comprise an interposer including at least one optical waveguide comprising a first end and a second end, and a substrate comprising the at least one optoelectronic device, at least one optical receiving/emitting element and at least one optical channel. The interposer and the substrate are in optical communication so that light coupled out of the at least one optical waveguide is coupled in the at least one optical receiving/emitting element and/or light coupled out of the at least one optical receiving/emitting element is coupled in the at least one optical waveguide of the interposer.

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

Abstract: Methods for coupling of waveguides with dissimilar mode field diameters, and related apparatuses, components, and systems are disclosed. In one example, a waveguide coupling assembly includes an input waveguide having a first mode, and a transition waveguide having a first transition waveguide section, a second transition waveguide section, and a tapered section. The first transition waveguide section has a second mode and is disposed proximate to the input waveguide such that a phase matching condition is achieved between the input waveguide and the first transition waveguide section, thereby evanescently coupling the input waveguide to the first transition waveguide section of the transition waveguide. The tapered section is optically connected between the first transition waveguide section and the second transition waveguide section, such that the second mode of the first transition waveguide section is converted to the third mode of the second transition waveguide section by the tapered section.

Abstract: A method of bonding an optical fiber in a ferrule includes disposing the ferrule at least partially in a conductive assembly such that a conductive element of the conductive assembly contacts a portion of the ferrule. Energy delivered to the bonding agent via thermal transfer from the conductive element brings the bonding agent to a securing temperature. Cooling the bonding agent to secure the optical fiber in the bore of the ferrule. Related systems are also disclosed.

Abstract: Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device are disclosed. Interposer assemblies comprise an interposer including at least one optical waveguide comprising a first end and a second end, and a substrate comprising the at least one optoelectronic device, at least one optical receiving/emitting element and at least one optical channel. The interposer and the substrate are in optical communication so that light coupled out of the at least one optical waveguide is coupled in the at least one optical receiving/emitting element and/or light coupled out of the at least one optical receiving/emitting element is coupled in the at least one optical waveguide of the interposer.

Abstract: Optical connectors and optical couplings for fiber-to-chip optical connections are disclosed. In one embodiment, an optical connector includes a ferrule body having a surface, an optical interface disposed within the surface. The optical interface is recessed with respect to the surface by an offset distance, and at least one fiber bore through the ferrule body and terminating at the optical interface. The optical connector further includes at least one optical fiber disposed within the at least one fiber bore such that the optical fiber protrudes beyond a surface of the optical interface. In another embodiment, a compliant material is disposed on a ferrule surface of a ferrule body such that one or more optical fibers pass through the compliant material and protrude beyond a surface of the compliant material. A clamp may also be provided to clamp the optical connector to a substrate.

Abstract: Optical connectors and optical couplings for fiber-to-chip optical connections are disclosed. In one embodiment, an optical connector includes a ferrule body having a surface, an optical interface disposed within the surface. The optical interface is recessed with respect to the surface by an offset distance, and at least one fiber bore through the ferrule body and terminating at the optical interface. The optical connector further includes at least one optical fiber disposed within the at least one fiber bore such that the optical fiber protrudes beyond a surface of the optical interface. In another embodiment, a compliant material is disposed on a ferrule surface of a ferrule body such that one or more optical fibers pass through the compliant material and protrude beyond a surface of the compliant material. A clamp may also be provided to clamp the optical connector to a substrate.

Abstract: A ferrule includes a body extending in a longitudinal direction between a front end and a back end of the ferrule. The front end defines a first end face and a pedestal extending from the first end face in the longitudinal direction. The ferrule also includes first and second groups of micro-holes extending into the body from the first end face. Each micro-hole is configured to receive an optical fiber. The pedestal is positioned between the first and second groups of micro-holes. Optical connectors including the ferrule are also disclosed, as are cable assemblies and related methods.

Abstract: Methods for coupling of waveguides with dissimilar mode field diameters, and related apparatuses, components, and systems are disclosed. In one example, a waveguide coupling assembly includes an input waveguide having a first mode, and a transition waveguide having a first transition waveguide section, a second transition waveguide section, and a tapered section. The first transition waveguide section has a second mode and is disposed proximate to the input waveguide such that a phase matching condition is achieved between the input waveguide and the first transition waveguide section, thereby evanescently coupling the input waveguide to the first transition waveguide section of the transition waveguide. The tapered section is optically connected between the first transition waveguide section and the second transition waveguide section, such that the second mode of the first transition waveguide section is converted to the third mode of the second transition waveguide section by the tapered section.

Abstract: An expanded-beam ferrule for an optical interface device has a ferrule body with a fiber support feature that supports an optical fiber. The ferrule body defines a lens having a planar back surface and a convex and aspheric front surface. The lens has a select amount of on-axis spherical aberration that gives rise to an improved coupling efficiency and in particular provided tolerance to misalignments between confronting expanded-beam ferrules used in an expanded-beam optical interface device. The ferrule body can also include multiple lenses and can support multiple optical fibers in operable alignment thereto.