Abstract: An insole configured to be disposed in a shoe worn by a person, in particular during a walking period of the person. The insole includes a force and/or pressure measurement unit configured to acquire at least one representative measurement of the force and/or pressure exerted on the insole by the person, a motion measurement acquisition unit configured to acquire at least one measure representative of a motion of the person’s foot, and a processing unit configured to receive the force and/or pressure measurement and the motion measurement, to compute at least one walking parameter and to control the emission of stimulation at a walking moment according to the value of the walking parameter.

Abstract: An insole for insertion into an article of footwear, comprising flexible upper sheet, lower sheet, insulating dielectric sheet, capacitive force sensors with upper electrodes and lower electrodes and networks of upper conductive leads and lower conductive leads. The insole comprises a chip support member and control and transmit electronics comprising a control electronic and a wireless transceiver. An upper contacting tab of the upper sheet is in surface contact with the chip support member and comprises conductive leads connected to the upper electrodes. A lower contacting tab of the lower sheet is in surface contact with the chip support member and comprises conductive leads connected to the lower electrodes.

Abstract: An insole for insertion into an article of foot wear, comprising flexible upper sheet, lower sheet, insulating dielectric sheet, capacitive force sensors with upper electrodes and lower electrodes and networks of upper conductive leads and lower conductive leads. The insole comprises a chip support member and control and transmit electronics comprising a control electronic and a wireless transceiver. An upper contacting tab of the upper sheet is in surface contact with the chip support member and comprises conductive leads connected to the upper electrodes. A lower contacting tab of the lower sheet is in surface contact with the chip support member and comprises conductive leads connected to the lower electrodes.