Abstract: There is provided a system having a server unit with a host processor and a service processor, a first bus interface and a second bus interface, a data storage unit with a plurality of drives grouped into a first and second group, a first serial-to-parallel-input/output (S2PIO) device connected to the first group, and a second S2PIO device connected to the second group. The system is configured to acquire, by the service processor from the host processor, an indication of a faulty memory drive in the data storage unit, the indication being indicative of a target link amongst the first link and the second link, and a position of the faulty memory drive in the target group. The system is configured to transmit, by the service processor using the target link, a command to a target S2PIO device for triggering a visual indicator associated with the faulty memory drive.

Abstract: A chassis structure is disclosed. The chassis structure has a chassis with a storage space and a computer node. The storage space is provided for accommodating the computer node. The node has a body removably stored in the storage space. The body has a front and a back portion. The node has a tray frame located in the front portion. The node has a sliding assembly for longitudinally and slideably moving the tray frame between a received and a withdrawn position. The back portion has a first and a second ducting structure, and is provided for accommodating two components. The first ducting structure disposed over the first component, and the second ducting structure disposed over the second component. The first ducting structure is offset from the second ducting structure for guiding different portions of the fluid flow over the first component and the second component, respectively.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: “A chassis structure is disclosed. The chassis structure has a chassis with a storage space and a computer node. The storage space is provided for accommodating the computer node. The node has a body removably stored in the storage space. The body has a front and a back portion. The node has a tray frame located in the front portion. The node has a sliding assembly for longitudinally and slideably moving the tray frame between a received and a withdrawn position. The back portion has a first and a second ducting structure, and is provided for accommodating two components. The first ducting structure disposed over the first component, and the second ducting structure disposed over the second component. The first ducting structure is offset from the second ducting structure for guiding different portions of the fluid flow over the first component and the second component, respectively.

Abstract: A dual-action storage media chassis system comprising: a chassis and two storage media modules accommodated in the chassis. The chassis defining a central back storage space accommodating a processor unit having a third operating temperature. Each storage media module including: a tray frame, each tray frame including a top access opening; a first plurality of storage media (having a first operating temperature) arranged into a front portion of the tray frame through the top access opening; a second plurality of storage media (having a second operating temperature) arranged into a back portion of the tray frame through the top access opening; the front portion, the back portion and the central back storage space being disposed longitudinally sequentially in the dual-action storage media chassis system, such that the second operating temperature is superior to the first operating temperature, and the third operating temperature is superior to the second operating temperature.

Abstract: A dual-action storage media chassis system comprising: a chassis and two storage media modules accommodated in the chassis. The chassis defining a central back storage space accommodating a processor unit having a third operating temperature. Each storage media module including: a tray frame, each tray frame including a top access opening; a first plurality of storage media (having a first operating temperature) arranged into a front portion of the tray frame through the top access opening; a second plurality of storage media (having a second operating temperature) arranged into a back portion of the tray frame through the top access opening; the front portion, the back portion and the central back storage space being disposed longitudinally sequentially in the dual-action storage media chassis system, such that the second operating temperature is superior to the first operating temperature, and the third operating temperature is superior to the second operating temperature.

Abstract: A dual-action storage media chassis system comprising: a chassis and two storage media modules accommodated in the chassis. The chassis defining a central back storage space accommodating a processor unit having a third operating temperature. Each storage media module including: a tray frame, each tray frame including a top access opening; a first plurality of storage media (having a first operating temperature) arranged into a front portion of the tray frame through the top access opening; a second plurality of storage media (having a second operating temperature) arranged into a back portion of the tray frame through the top access opening; the front portion, the back portion and the central back storage space being disposed longitudinally sequentially in the dual-action storage media chassis system, such that the second operating temperature is superior to the first operating temperature, and the third operating temperature is superior to the second operating temperature.

Abstract: A dual-action storage media chassis system comprising: a chassis and two storage media modules accommodated in the chassis. The chassis defining a central back storage space accommodating a processor unit having a third operating temperature. Each storage media module including: a tray frame, each tray frame including a top access opening; a first plurality of storage media (having a first operating temperature) arranged into a front portion of the tray frame through the top access opening; a second plurality of storage media (having a second operating temperature) arranged into a back portion of the tray frame through the top access opening; the front portion, the back portion and the central back storage space being disposed longitudinally sequentially in the dual-action storage media chassis system, such that the second operating temperature is superior to the first operating temperature, and the third operating temperature is superior to the second operating temperature.

Abstract: A dual-action storage media chassis system comprising: a chassis and two storage media modules accommodated in the chassis. The chassis defining a central back storage space accommodating a processor unit having a third operating temperature. Each storage media module including: a tray frame, each tray frame including a top access opening; a first plurality of storage media (having a first operating temperature) arranged into a front portion of the tray frame through the top access opening; a second plurality of storage media (having a second operating temperature) arranged into a back portion of the tray frame through the top access opening; the front portion, the back portion and the central back storage space being disposed longitudinally sequentially in the dual-action storage media chassis system, such that the second operating temperature is superior to the first operating temperature, and the third operating temperature is superior to the second operating temperature.

Abstract: A dual-action storage media chassis system comprising: a chassis and two storage media modules accommodated in the chassis. The chassis defining a central back storage space accommodating a processor unit having a third operating temperature. Each storage media module including: a tray frame, each tray frame including a top access opening; a first plurality of storage media (having a first operating temperature) arranged into a front portion of the tray frame through the top access opening; a second plurality of storage media (having a second operating temperature) arranged into a back portion of the tray frame through the top access opening; the front portion, the back portion and the central back storage space being disposed longitudinally sequentially in the dual-action storage media chassis system, such that the second operating temperature is superior to the first operating temperature, and the third operating temperature is superior to the second operating temperature.