Abstract: An electric heating device (20) is described which has at least one first electrically conductive component (21), at least one heating layer (22) and at least one second electrically conductive component (23). According to the invention, it is envisaged that the first electrically conductive component (21) and/or the second electrically conductive component (23) is/are produced and/or arranged on the heating layer (22) by means of a thermal spraying process. Alternatively or additionally, according to the invention, it is envisaged that the electrically conductive components (21, 23) and the heating layer (22) are arranged with respect to one another in such a way that a current flow perpendicularly to the plane of the heating layer (22) and/or in the direction of the plane of the heating layer (22) is realized or can be realized. In order to produce an assembly (10), such a heating device (20) can preferably be arranged on a substrate element (11). Furthermore, a suitable production method is described.

Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.

Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

Abstract: An electric heating device (20) is described which has at least one first electrically conductive component (21), at least one heating layer (22) and at least one second electrically conductive component (23). According to the invention, it is envisaged that the first electrically conductive component (21) and/or the second electrically conductive component (23) is/are produced and/or arranged on the heating layer (22) by means of a thermal spraying process. Alternatively or additionally, according to the invention, it is envisaged that the electrically conductive components (21, 23) and the heating layer (22) are arranged with respect to one another in such a way that a current flow perpendicularly to the plane of the heating layer (22) and/or in the direction of the plane of the heating layer (22) is realized or can be realized. In order to produce an assembly (10), such a heating device (20) can preferably be arranged on a substrate element (11). Furthermore, a suitable production method is described.

Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.