Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging and monitoring a target while a separate radiation is applied to treat the target.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging, monitoring, medical diagnostics and medical treatment applications.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging and monitoring a target while a separate radiation is applied to treat the target.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging and monitoring a target while a separate radiation is applied to treat the target.

Abstract: A method and system for inspecting a surface of a semiconductor workpiece comprises providing a surface inspection system and using the surface inspection apparatus to cause laser light to impinge upon a test location on the workpiece surface and thereby cause the laser light to emerge from the surface as returned light comprising at least one of reflected light and scatter light; collecting the returned light and generating a signal from the returned and collected light, the signal comprising a signal value representative of a characteristic of the workpiece surface at the test location; providing a plurality of threshold candidates and causing the surface inspection system to select a threshold from among the plurality of threshold candidates; comparing the threshold to the signal value to obtain a difference value; using the difference value to assess the characteristic of the workpiece surface at the test location; and using the surface inspection system to automatically cause the method to be repeated fo

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging, monitoring, medical diagnostics and medical treatment applications.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging, monitoring, medical diagnostics and medical treatment applications.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging and monitoring a target while a separate radiation is applied to treat the target.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging, monitoring, medical diagnostics and medical treatment applications.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging, monitoring, medical diagnostics and medical treatment applications.

Abstract: Techniques, apparatus and systems that use an optical probe head to deliver light to a target and to collect light from the target for imaging, monitoring, medical diagnostics and medical treatment applications.

Abstract: A method and system for inspecting a surface of a semiconductor workpiece comprises providing a surface inspection system and using the surface inspection apparatus to cause laser light to impinge upon a test location on the workpiece surface and thereby cause the laser light to emerge from the surface as returned light comprising at least one of reflected light and scatter light; collecting the returned light and generating a signal from the returned and collected light, the signal comprising a signal value representative of a characteristic of the workpiece surface at the test location; providing a plurality of threshold candidates and causing the surface inspection system to select a threshold from among the plurality of threshold candidates; comparing the threshold to the signal value to obtain a difference value; using the difference value to assess the characteristic of the workpiece surface at the test location; and using the surface inspection system to automatically cause the method to be repeated fo

Abstract: A system comprising a means for generating an optical pump beam pulse and for directing the optical pump beam pulse to a first area of a surface of a sample having a plurality of film layers to generate an acoustic signal, a means for generating an x-ray probe pulse and for directing the x-ray probe pulse to a second area of the surface, a means for detecting an intensity of a diffracted x-ray probe pulse the intensity varying in response to the acoustic signal to form a probe pulse response signal, and a means for calculating an expected transient response to a theoretical acoustic signal propagated through a model of the sample and fitting the probe pulse response to the transient response to derive at least one characteristic of the sample.

Abstract: Disclosed are methods and apparatus for reducing thermal loading of a film disposed on a surface of a sample, such as a semiconductor wafer, while obtaining a measurement of a thickness of the film in an area about a measurement site. The method includes steps of (a) bringing an optical assembly of the measurement system into focus; (b) aligning a beam spot with the measurement site; (c) turning on one of a dither EOM or a dither AOM or a piezo-electric dither assembly to sweep the beam spot in an area about the measurement site, thereby reducing the thermal loading within the measurement site; (d) making a measurement by obtaining a signal representing an average for the film under the area; (e) recording the measurement data; and (f) analyzing the measurement data to determine an average film thickness in the measurement area.

Abstract: Disclosed are methods and apparatus for reducing thermal loading of a film disposed on a surface of a sample, such as a semiconductor wafer, while obtaining a measurement of a thickness of the film in an area about a measurement site. The method includes steps of (a) bringing an optical assembly of the measurement system into focus; (b) aligning a beam spot with the measurement site; (c) turning on one of a dither EOM or a dither AOM or a piezo-electric dither assembly to sweep the beam spot in an area about the measurement site, thereby reducing the thermal loading within the measurement site; (d) making a measurement by obtaining a signal representing an average for the film under the area; (e) recording the measurement data; and (f) analyzing the measurement data to determine an average film thickness in the measurement area.