Abstract: A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

Abstract: A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

Abstract: A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

Abstract: The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure that is easy to assemble, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

Abstract: The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

Abstract: The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

Abstract: The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

Abstract: The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

Abstract: The invention relates to thermoelectric systems, devices and methods for generating energy and, providing cooling and heating. Non-ceramic thermoelectric technology is employed. In the invention, non-ceramic substrates are used to replace the ceramic layers which are typically utilized in conventional thermoelectric structures. The non-ceramic substrates can be selected from metals and metal-containing materials known in the art which have a surface modification, such as but not limited to, a coating or a surface restructuring. The incorporation of non-ceramic substrates allows several other components which are associated with the use of ceramic layers in conventional thermoelectric structures to be eliminated from the thermoelectric device.