Abstract: Disclosed is a waveguide assembly for a head-mounted display device. The waveguide assembly can comprise a waveguide carrier, a first left waveguide, and a first right waveguide. The waveguide carrier can include a nose bridge portion, and flat left and right mounting surfaces extending from the nose bridge portion, to align with a left eye and a right eye, respectively, of a user of the head-mounted display device. The first left waveguide can be affixed to the left mounting surface of the waveguide carrier only by a first layer of adhesive disposed only around a periphery of a surface of the first left waveguide, while the first right waveguide can be affixed to the right mounting surface of the waveguide carrier only by a second layer of the adhesive disposed only around a periphery of a surface of the first right waveguide.

Abstract: Disclosed is a low-profile microdisplay module that comprises a package substrate, a microdisplay chip disposed over a first surface of the package substrate, and a plurality of conductive vias. The plurality of conductive vias are electrically coupled to the microdisplay chip and disposed through the package substrate to a second surface of the package substrate, the second surface being opposite and parallel to the first surface. The microdisplay module further comprises a flexible flat circuit connector coupled to the plurality of conductive vias at the second surface of the package substrate.

Abstract: A head-mounted display (HMD) device designed for quick and easy mounting and dismounting to and from, respectively, a mounting fixture comprises a display assembly and a chassis coupled to the display assembly. The display assembly includes optical elements configured to convey light to the eyes of a human user when the head-mounted display device is worn by the user. In certain embodiments introduced here, the chassis has an external surface and a fixture interface surface defined within, but not coplanar with, the external surface. The fixture interface surface is configured to mate with a device interface surface of the mounting fixture when the head-mounted display device is mounted to the mounting fixture.

Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.

Abstract: A head-mounted display device includes a head fitting by which the display device can be worn on the head of a user, and a visor assembly mounted to the head fitting. The visor assembly includes a plurality of display elements arranged to be aligned with the eyes of the user, a plurality of sensors, and a protective enclosure that encloses the display elements and the sensors. The protective enclosure may include an upper portion aligned with the sensors and a lower portion aligned with the display elements. The upper portion may be substantially opaque to visible light and transparent to infrared light. The lower portion may have a variable tinting scheme in which at least some of the lower portion of the enclosure is transparent to visible light.

Abstract: A head-mounted display (HMD) device has a chassis, a display assembly, and various sensors and electronics, where the display assembly, sensors and electronics are mounted to the chassis and enclosed within a sealed protective visor, and where the display assembly is mounted to the chassis only through a central location that is aligned with a center-point between the user's eyes, thereby decoupling the display assembly from most mechanical and thermal stresses.

Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

Abstract: Rotational switch assemblies having a thin operational profile are provided for use in electronic devices. Rotational switch assemblies in accordance with embodiments of the invention can include a button, an engagement member, and switch housing. The switch housing includes a radial spring, a post, and at least two contact spring arms. The engagement member includes at least two contact pads and at least two position notches and is mounted to and operable to rotate about the post to one of at least two positions. When the button is moved from one position to another, this movement is translated to the engagement member, which rotates from one position to another, and as the engagement member rotates, the radial spring engages the position notch corresponding to the position of the engagement member, and one of the contact pads engages a corresponding one of the contact spring members for that position.

Abstract: Rotational switch assemblies having a thin operational profile are provided for use in electronic devices. Rotational switch assemblies in accordance with embodiments of the invention can include a button, an engagement member, and switch housing. The switch housing includes a radial spring, a post, and at least two contact spring arms. The engagement member includes at least two contact pads and at least two position notches and is mounted to and operable to rotate about the post to one of at least two positions. When the button is moved from one position to another, this movement is translated to the engagement member, which rotates from one position to another, and as the engagement member rotates, the radial spring engages the position notch corresponding to the position of the engagement member, and one of the contact pads engages a corresponding one of the contact spring members for that position.

Abstract: A component may be molded with an integral breakaway installation handle. The breakaway installation handle may be used to manipulate and maneuver the component during assembly operations and during component mounting operations. A technician may use the breakaway installation handle to mount the component to a fixture while applying adhesive, attaching a mesh, or performing other assembly operations on the component. Following assembly operations, the technician may use the breakaway installation handle to install the component in an electronic device. After installing the component in the electronic device, the technician may bend the breakaway installation handle with respect to the component until the breakaway installation handle breaks off from the component. Components having breakaway installation handles may be formed form an injection molding system in which mold cavities each receive molten plastic from a runner.

Abstract: Described embodiments provide a low profile hinge and pin mount to be mounted within a small encasement. The mount has a low profile and takes up minimal space within the small encasement without sacrificing structural support for a component and external forces placed on the mount. The mount includes a bracket, a pin and a fastener. The bracket includes a rounded end, a fastening end and a beam configured to support the component placed between the rounded end and the fastening end. The rounded end of the bracket is sized and shaped to fit in an enclosure of the encasement and to pivot about the pin during a rework process. Methods for installing and reworking the low profile hinge and pin mount are described.

Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

Abstract: Rotational switch assemblies having a thin operational profile are provided for use in electronic devices. Rotational switch assemblies in accordance with embodiments of the invention can include a button, an engagement member, and switch housing. The switch housing includes a radial spring, a post, and at least two contact spring arms. The engagement member includes at least two contact pads and at least two position notches and is mounted to and operable to rotate about the post to one of at least two positions. When the button is moved from one position to another, this movement is translated to the engagement member, which rotates from one position to another, and as the engagement member rotates, the radial spring engages the position notch corresponding to the position of the engagement member, and one of the contact pads engages a corresponding one of the contact spring members for that position.

Abstract: A low Z linear vibrator is described well suited for use in small form factor portable devices such as a smartphone. The low Z vibrator can be configured to include a beam structure that can be attached to a vibratory mass and a low profile actuator. The low profile actuator can cause the vibratory mass to oscillate in a well-defined and predictable manner.