Abstract: Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.