Patents by Inventor Andy BEHR

Andy BEHR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same
    Patent number: 11345784
    Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 31, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyosuke Michigami, Tomoaki Sawada, Tomohiro Fukao, Takatoshi Abe, Andy Behr
  • RESIN COMPOSITION, AND RESIN FILM, METAL FOIL WITH RESIN, METAL CLAD LAMINATE, WIRING BOARD, AND CIRCUIT MOUNT COMPONENT USING SAME
    Publication number: 20210363308
    Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
    Type: Application
    Filed: November 6, 2019
    Publication date: November 25, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyosuke MICHIGAMI, Tomoaki SAWADA, Tomohiro FUKAO, Takatoshi ABE, Andy BEHR