Abstract: Various techniques for removing heat from electronic devices are disclosed herein. In one embodiment, an electronic device includes a processor having a first surface area and a heat spreader in direct contact with the processor. The heat spreader has a second surface area greater than the first surface area of the processor. The electronic device also includes a housing panel spaced apart from the heat spreader by a gap. The housing panel has an air inlet proximate a first end of the gap and an air outlet proximate a second end of the gap. The electronic device further includes an air mover configured to move cooling air through the gap from the air inlet toward the air outlet of the housing panel.