Patents by Inventor Andy Farlow

Andy Farlow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip-scale package
    Patent number: 8466546
    Abstract: A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: June 18, 2013
    Assignee: International Rectifier Corporation
    Inventors: Andy Farlow, Mark Pavier, Andrew N. Sawle, George Pearson, Martin Standing
  • Process for fabricating a semiconductor package
    Patent number: 7923289
    Abstract: A process for fabricating a semiconductor package which includes using an exothermically active nanoparticle paste to join an electrode of a semiconductor die to a support body.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: April 12, 2011
    Assignee: International Rectifier Corporation
    Inventors: Mark Pavier, Andy Farlow
  • Process for fabricating a semiconductor package
    Publication number: 20070231960
    Abstract: A process for fabricating a semiconductor package which includes using an exothermically active nanoparticle paste to join an electrode of a semiconductor die to a support body.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 4, 2007
    Inventors: Mark Pavier, Andy Farlow
  • Chip-scale package
    Publication number: 20060249836
    Abstract: A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.
    Type: Application
    Filed: April 21, 2006
    Publication date: November 9, 2006
    Inventors: Andy Farlow, Mark Pavier, Andrew Sawle, George Pearson, Martin Standing