Abstract: An apparatus includes a transfer element that is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as to span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate.

Abstract: An apparatus includes a first frame that holds a wafer tape and a second frame that clamps a product substrate. A transfer element is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate. At least one energy source is directed at a portion of the product substrate corresponding to the transfer position at which the group of dies contacts the circuit trace to apply energy to the circuit trace to affix the group of dies to the circuit trace.

Abstract: An apparatus includes a first frame that holds a wafer tape and a second frame that clamps a product substrate. A transfer element is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate. At least one energy source is directed at a portion of the product substrate corresponding to the transfer position at which the group of dies contacts the circuit trace to apply energy to the circuit trace to affix the group of dies to the circuit trace.

Abstract: An apparatus includes a housing including a plurality of light sources to provide backlighting for the apparatus. A first portion of the plurality of light sources is configured to provide a first color temperature setting. A second portion of the plurality of light sources is configured to provide a second color temperature setting. The apparatus includes a controller including one or more processors configured to execute instructions stored on memory, which when executed, cause the one or more controllers to set at least one of an overall color temperature setting for the backlighting of the apparatus, or a partial color temperature setting for the backlighting of the apparatus.

Abstract: A waterproof sealed circuit apparatus includes a circuit substrate having a first side opposite a second side. The first side includes a circuit trace. A semiconductor device die is electrically coupled to the circuit trace on the first side of the circuit substrate. A polymer sealing layer is adhered to the first side of the circuit substrate and covers the semiconductor device die. Polymer chains of the sealing layer are crosslinked.

Abstract: An apparatus includes a first frame that holds a wafer tape and a second frame that clamps a product substrate. A transfer element is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate. At least one energy source is directed at a portion of the product substrate corresponding to the transfer position at which the group of dies contacts the circuit trace to apply energy to the circuit trace to affix the group of dies to the circuit trace.

Abstract: An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The semiconductor die is disposed on the transfer surface of the product substrate such that at least a portion of the first surface is in contact with the transfer surface, and at least a portion of the second surface is embedded onto the product substrate, beneath a plane that extends across the transfer surface.

Abstract: An apparatus includes a housing including a plurality of light sources to provide backlighting for the apparatus. A first portion of the plurality of light sources is configured to provide a first color temperature setting. A second portion of the plurality of light sources is configured to provide a second color temperature setting. The apparatus includes a controller including one or more processors configured to execute instructions stored on memory, which when executed, cause the one or more controllers to set at least one of an overall color temperature setting for the backlighting of the apparatus, or a partial color temperature setting for the backlighting of the apparatus.

Abstract: An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.