Abstract: A test and measurement instrument has an acquisition system to receive and digitize a batch of waveforms into a batch of digitized waveforms, a memory configured as a raster plane having rows and columns, a graphics processing unit (GPU) capable of processing multiple threads to rasterize the batch of digitized waveforms to the raster plane to form a batch histogram and to group multiple threads into groups of a first type of group, assign each thread group of the first type of group to one column in the raster plane, execute a common instruction per thread group of the first type to populate the raster plane, and transfer the batch histogram upon completion, and a central processing unit (CPU) to receive the batch histogram from the GPU, and display a map of the batch histogram on a display.

Abstract: An equivalent-time sampling test and measurement instrument for acquiring a repeating pattern signal under test at or near a maximum sampling speed of the test and measurement instrument. The test and measurement instrument includes a first input configured to receive repeating pattern information about a signal under test, a second input configured to receive the signal under test, one or more processors configured to determine an optimized trigger holdoff period that is set based on a minimum trigger holdoff period of a test and measurement instrument, and an acquisition unit configured to acquire a portion of the signal under test every optimized trigger holdoff period.

Abstract: A wireless sensor is provided to obtain information relating to vibration of wafers or substrates in a semiconductor processing system. In one exemplary embodiment, a wireless substrate-like sensor is provided and includes a power source adapted to provide power to the sensor, a wireless communication module coupled to the power source, and a controller coupled to the power source and the wireless communication module. An acceleration detection component is operably coupled to the controller to provide information relative to acceleration of the sensor in three axes.

Abstract: A method of sensing proximity to a showerhead in a semiconductor-processing system is provided. The method includes measuring a parameter that varies with proximity to the showerhead, as well as with at least one external factor. The method also includes measuring a parameter that does not vary with proximity to the showerhead, but does vary with the at least one factor. A compensated proximity output is calculated based upon the measured parameters and is provided as an output.

Abstract: A wireless sensor is provided to obtain information relating to vibration of wafers or substrates in a semiconductor processing system. In one exemplary embodiment, a wireless substrate-like sensor is provided and includes a power source adapted to provide power to the sensor, a wireless communication module coupled to the power source, and a controller coupled to the power source and the wireless communication module. An acceleration detection component is operably coupled to the controller to provide information relative to acceleration of the sensor in three axes.