Abstract: Described herein are methods and apparatus in which two integrated circuit dies are stacked and embedded in a printed circuit board (PCB) substrate. In one embodiment, the two dies are stacked directly on top of one another with and electrically connected with through-silicon-vias (TSVs). The interconnect routing between the two die occurs within the TSVs and die level redistribution layer (RDL) routing. The resulting die stack can then be embedded into a single layer of the PCB substrate rather than in two separate layers.

Abstract: A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.

Abstract: A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.

Abstract: Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a flexible circuit substrate and an integrated circuit die embedded within the flexible circuit substrate. The integrated circuit die includes a digital signal processor (DSP) die, in an embodiment. In various embodiments, the DSP die includes a DSP configured to provide processing for the hearing assistance device.