Abstract: A propulsor fan and drive system having reduced noise emission is disclosed. The propulsor fan includes a blade fan having a plurality of blades. The blades may include a dual pin-root design to secure the blade fan to a hub and a shroud at tips of the blades. The blades may include one or more knife edge seals that protrude from a surface of the shroud.

Abstract: A method for utilizing an attachment assembly for supporting a quartz sleeve to prevent vibration, comprising at least one vibration resistant member, a collar attachment member and a support plate. The vibration resistant member is adaptable to hold and support the quartz sleeve positioned inside an ultraviolet (UV) cylinder. The collar attachment member is configured to enclose the vibration resistant member. The support plate is configured to attach the collar attachment member containing the vibration resistant member with the UV cylinder. The attachment assembly can be attached to the UV cylinder wall directly or can be attached to a mounting device inside the UV cylinder wall.

Abstract: A method and an attachment assembly for supporting a quartz sleeve, comprises at least one vibration resistant member, a collar attachment member and a support plate. The at least one vibration resistant member is adaptable to hold and support the quartz sleeve positioned inside an ultraviolet (UV) cylinder and thereby to prevent its vibration. The collar attachment member is configured to enclose the at least one vibration resistant member. The at least one vibration resistant member is positioned inside the collar attachment member. The support plate is configured to attach the collar attachment member containing the at least one vibration resistant member with the UV cylinder. The attachment assembly can be attached to the UV cylinder wall directly or can be attached to a mounting device inside the UV cylinder wall.

Abstract: Embodiments of the present disclosure provide methodology to match and calibrate processing chamber performance in a processing chamber. In one embodiment, a method for calibrating a processing chamber for semiconductor manufacturing process includes performing a first predetermined process in a processing chamber, collecting a first set of signals transmitted from a first group of sensors disposed in the processing chamber to a controller while performing the predetermined process, analyzing the collected first set of signals, comparing the collected first set of signals with database stored in the controller to check sensor responses from the first group of sensors, calibrating sensors based on the collected first set of signals when a mismatch sensor response is found, subsequently performing a first series of processes in the processing chamber, and collecting a second set of signals transmitted from the sensors to the controller while performing the series of processes.

Abstract: Embodiments of the present disclosure provide methodology to match and calibrate processing chamber performance in a processing chamber. In one embodiment, a method for calibrating a processing chamber for semiconductor manufacturing process includes performing a first predetermined process in a processing chamber, collecting a first set of signals transmitted from a first group of sensors disposed in the processing chamber to a controller while performing the predetermined process, analyzing the collected first set of signals, comparing the collected first set of signals with database stored in the controller to check sensor responses from the first group of sensors, calibrating sensors based on the collected first set of signals when a mismatch sensor response is found, subsequently performing a first series of processes in the processing chamber, and collecting a second set of signals transmitted from the sensors to the controller while performing the series of processes.

Abstract: One embodiment of the invention includes a flexible circuit and a stiffener. The flexible circuit has first, second, and third portions. The first portion is folded on an upper surface of the third portion and has first contact elements attached to a first device. The second portion is folded on the first device and has second contact elements attached to a second device. The stiffener is attached to the upper surface of the third portion and located between the upper surface of the third portion and the first portion.

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.