Patents by Inventor Andy M. Homick

Andy M. Homick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9236673
    Abstract: A mezzanine header connector includes header modules stacked side-by-side having housing frames holding contact assemblies. Each contact assembly includes header contacts held by at least one dielectric holder. The header contacts have mating segments for termination to corresponding receptacle contacts of a mezzanine receptacle connector and terminating segments for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. Each housing frame has walls defining pockets receiving corresponding header contacts of the contact assembly. The housing frame is conductive and provides shielding around the associated header contacts of the contact assemblies. The header contacts face associated walls with air separating the header contacts and the walls along a majority of the header contacts.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: January 12, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: James Myoungsoo Jeon, Chad W. Morgan, Andy M. Homick, Paul Hollis
  • Publication number: 20150303601
    Abstract: A mezzanine header connector includes header modules stacked side-by-side having housing frames holding contact assemblies. Each contact assembly includes header contacts held by at least one dielectric holder. The header contacts have mating segments for termination to corresponding receptacle contacts of a mezzanine receptacle connector and terminating segments for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. Each housing frame has walls defining pockets receiving corresponding header contacts of the contact assembly. The housing frame is conductive and provides shielding around the associated header contacts of the contact assemblies. The header contacts face associated walls with air separating the header contacts and the walls along a majority of the header contacts.
    Type: Application
    Filed: May 21, 2014
    Publication date: October 22, 2015
    Applicant: Tyco Electronics Corporation
    Inventors: James Myoungsoo Jeon, Chad W. Morgan, Andy M. Homick, Paul Hollis