Patents by Inventor Andy Mantey

Andy Mantey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board assembly
    Patent number: 10673160
    Abstract: The present disclosure includes a circuit board assembly that may include a circuit board that may include an aperture. The circuit board assembly may include a reverse header. The reverse header may include a base and a plurality of pins connected to the base. A portion of each of the plurality of pins may be disposed at least partially in the aperture. The circuit board may be configured an insulated metal substrate circuit board.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 2, 2020
    Assignee: Lear Corporation
    Inventors: Ralf Baier, Claus Brendel, Udo Angermueller, Andy Mantey
  • CIRCUIT BOARD ASSEMBLY
    Publication number: 20180102601
    Abstract: The present disclosure includes a circuit board assembly that may include a circuit board that may include an aperture. The circuit board assembly may include a reverse header. The reverse header may include a base and a plurality of pins connected to the base. A portion of each of the plurality of pins may be disposed at least partially in the aperture. The circuit board may be configured an insulated metal substrate circuit board.
    Type: Application
    Filed: October 5, 2017
    Publication date: April 12, 2018
    Inventors: Ralf Baier, Claus Brendel, Udo Angermueller, Andy Mantey
  • TEMPERATURE-CONTROL ELEMENT AND METHOD FOR ATTACHING AN ELECTRONIC COMPONENT TO THE TEMPERATURE-CONTROL ELEMENT
    Publication number: 20140076525
    Abstract: The present invention relates to a temperature-control element. The present invention relates to a temperature-control element, having at least one surface region with an electrically insulating and thermally conductive coating, in particular a ceramic coating provided on said surface region, and attached to the coating is at least one electronic component which is thermally connected to the temperature-control element and is configured to be electrically insulating with respect to the temperature-control element. The present invention also relates to a method for attaching an electronic component to the temperature-control element.
    Type: Application
    Filed: February 15, 2012
    Publication date: March 20, 2014
    Inventors: Andy Mantey, Johannes Dippold