Patents by Inventor Andy Scherer

Andy Scherer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HELICAL DEBULKING TOOL WITH CUTTER
    Publication number: 20250352237
    Abstract: An intravascular therapy device (10) includes an intravascular catheter (12); a helical coil (14) disposed at a distal end (13) of the intravascular catheter; at least one cutter (16) mounted on the helical coil; and a rotary control (18) disposed at a proximal end (15) of the intravascular catheter and operatively connected to rotate the helical coil.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 20, 2025
    Inventors: Andy Scherer, Sooneon Bae, Ryan Sotak
  • PHOTIMECHANICAL VASCULAR THERAPY
    Publication number: 20250000579
    Abstract: A thrombectomy or atherectomy device (10) includes a catheter (12); a capture device (22, 221) disposed at a distal end of the catheter; and a laser aperture (24, 241) disposed proximate to the capture device and configured to ablate material of a clot (C) in a blood vessel (V) of a patient that is captured by the capture device.
    Type: Application
    Filed: December 5, 2022
    Publication date: January 2, 2025
    Inventors: Cedar Decker, Sooneon Bae, Andy Scherer
  • Plug for endoscope attachment tip
    Patent number: 11510554
    Abstract: Reversibly attachable pressure-resistant cap for an endoscope sleeve, configured to seal a distal tip of the endoscope sleeve during pressurized inflation of the sleeve to assist insertion of the endoscope into the sleeve. The cap is operable to latch onto the distal tip. The cap is also configured to be easily removed from the distal tip after inflation is no longer needed.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: November 29, 2022
    Assignee: Motus GI Methical Technologies Ltd.
    Inventors: Brad D. Aurilia, Brad William Caldeira, Mark Pomeranz, Andy Scherer, Jeffrey Smith
  • Method for encapsulating an electrochemical sensor
    Patent number: 5665653
    Abstract: An electrochemical sensor assembly which allows a solution to make contact with an active sensing area of a sensor, while constraining the solution such that the fluid does not contact the sensor electronics and a method for fabricating such a sensor assembly. A sensor assembly is fabricated in accordance with a simple process, including: fabricating a master pattern which matches the external profile of an epoxy shell which will encapsulate a substrate upon which the sensors are mounted; forming a flexible tool (or mold) which conforms to the general profile of the master pattern; placing sensors together with any other desired electronic circuitry on a substrate (such as a printed circuit board or a ceramic pad to form a "hybrid"); pressing a number of electrical contact points on the hybrid and the active sensing area of each sensor on the substrate into contact with flexible protrusions of the flexible tool; and potting the hybrid.
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: September 9, 1997
    Assignee: Unifet, Incorporated
    Inventors: Rex O. Bare, Andy Scherer