Patents by Inventor Andy Toffelmire

Andy Toffelmire has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11223166
    Abstract: An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: January 11, 2022
    Assignee: Amphenol Corporation
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Publication number: 20200287331
    Abstract: An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.
    Type: Application
    Filed: April 20, 2020
    Publication date: September 10, 2020
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Patent number: 10770839
    Abstract: A method of assembling an electrical connector that is configured for mounting to a printed circuit board. The method has the steps of providing contact wafers with a plurality of contacts; bending the tail ends of each contact wafer; interleaving the contact wafers to form one or more contact wafer assemblies; loading the contact wafer assemblies into an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector; and inserting the insert into a shell of the electrical connector.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: September 8, 2020
    Assignee: Amphenol Corporation
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Publication number: 20200067236
    Abstract: A method of assembling an electrical connector that is configured for mounting to a printed circuit board. The method has the steps of providing contact wafers with a plurality of contacts; bending the tail ends of each contact wafer; interleaving the contact wafers to form one or more contact wafer assemblies; loading the contact wafer assemblies into an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector; and inserting the insert into a shell of the electrical connector.
    Type: Application
    Filed: August 22, 2018
    Publication date: February 27, 2020
    Inventors: Zlatan Ljubijankic, Barbara H. Marten, Ming Jong, Andy Toffelmire
  • Patent number: 10243307
    Abstract: A wafer assembly for an electrical connector, and method for making, that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board where the mating and tail ends extend from opposite sides of the wafer. A conductive spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more electronic components in electrical contact with the spring member and one of the contacts.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: March 26, 2019
    Assignee: Amphenol Corporation
    Inventors: Zlatan Ljubijankic, Andy Toffelmire, Peter E. Jay, Barbara H. Marten, Valeria Caraiani, Andrew B. Matus
  • Publication number: 20190067888
    Abstract: A wafer assembly for an electrical connector, and method for making, that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board where the mating and tail ends extend from opposite sides of the wafer. A conductive spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more electronic components in electrical contact with the spring member and one of the contacts.
    Type: Application
    Filed: April 3, 2018
    Publication date: February 28, 2019
    Inventors: Zlatan LJUBIJANKIC, Andy Toffelmire, Peter E. Jay, Barbara H. Marten, Valeria Caraiani, Andrew B. Matus
  • Patent number: 9991642
    Abstract: A wafer assembly for an electrical connector that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board and an overmold covering the body portion such that the mating and tail ends extend from opposite sides of the overmold. A conductive elongated spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more filter components.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: June 5, 2018
    Assignee: Amphenol Corporation
    Inventors: Zlatan Ljubijankic, Andy Toffelmire, Peter E. Jay, Barbara H. Marten, Valeria Caraiani, Andrew B. Matus