Patents by Inventor Aneesh Khullar

Aneesh Khullar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200393477
    Abstract: Disclosed are apparatuses, systems, and methods for processing materials, including biological or chemical materials. A manufacturing module may include a work station configured to perform a process involving equipment capable of use with biological or chemical material, a first transportation segment that is configured to connect and disconnect with a second transportation segment such that when connected, a carrier of the biological or chemical material can be transported from the first transportation segment to the second transportation segment, a pick and place robot configured to move an element between the first transportation segment and the work station; and a movement mechanism configured to allow the work station, the first transportation segment, and the pick and place robot to be moved as a single unit. A system may include a plurality of manufacturing modules that are reconfigurable to a plurality of configurations.
    Type: Application
    Filed: May 23, 2019
    Publication date: December 17, 2020
    Applicant: Zymergen Inc.
    Inventors: Jay S. Davey, Matthew Jonathan Myers, William Serber, Aneesh Khullar, Christopher James Bremner, David J. McLoughlin
  • Patent number: 8126255
    Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: February 28, 2012
    Assignee: KLA-Tencor Corp.
    Inventors: Kris Bhaskar, Chetana Bhaskar, Ashok Kulkarni, Eliezer Rosengaus, Cecelia Campochiaro, Chris Maher, Brian Duffy, Aneesh Khullar, Alpa Kohli, Lalita A. Balasubramanian, Santosh Bhattacharyya, Mohan Mahadevan
  • Patent number: 8020750
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: September 20, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 8017028
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: September 13, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7984891
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: July 26, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Michael J. DeChellis, Chris Melcer, Erica R. Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7850786
    Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.
    Type: Grant
    Filed: October 17, 2006
    Date of Patent: December 14, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7559527
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: July 14, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Publication number: 20090080759
    Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
    Type: Application
    Filed: September 19, 2008
    Publication date: March 26, 2009
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Kris Bhaskar, Chetana Bhaskar, Ashok Kulkarni, Eliezer Rosengaus, Cecilia Campochiaro, Chris Maher, Brian Duffy, Aneesh Khullar, Alpa Kohli, Lalita A. Balasubramanian, Santosh Bhattacharyya, Mohan Mahadevan
  • Publication number: 20090039057
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: October 14, 2008
    Publication date: February 12, 2009
    Inventors: Mark Crockett, John W. Lane, Micahel J. DeChellis, Chris Melcer, Erica R. Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7459003
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: December 2, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Patent number: 7448276
    Abstract: A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: November 11, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
  • Publication number: 20070226973
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: April 19, 2007
    Publication date: October 4, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070200082
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: April 20, 2007
    Publication date: August 30, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070113663
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: August 23, 2006
    Publication date: May 24, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070062909
    Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.
    Type: Application
    Filed: October 17, 2006
    Publication date: March 22, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070062021
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: October 24, 2006
    Publication date: March 22, 2007
    Inventors: Mark Crockett, John Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20070051080
    Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: October 3, 2006
    Publication date: March 8, 2007
    Inventors: Mark Crockett, John Lane, Michael DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe Mohammed
  • Publication number: 20040119038
    Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
    Type: Application
    Filed: July 12, 2003
    Publication date: June 24, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Mark Crockett, John W. Lane, Michael J. DeChellis, Chris Melcer, Erica R. Porras, Aneesh Khullar, Balarabe N. Mohammed