Abstract: A mobile backhaul inter-mesh communication point forms an interface between a wireless mesh network on a first level and a wireless mesh network on a second, higher bandwidth, level. The two wireless networks are differentiated, e.g., by causing the mesh networks to be formed using different spectra, protocols or coding, or antennae. The mobile intra-mesh communication point functions as an access point in the lower level mesh network and as a relay point in the upper level mesh network. Utilizing mobile inter-mesh communication points facilitates deployment of wireless network access points while enabling the location of access points to follow the concentration of network users. Mobile inter-mesh communication points may be deployed in personal vehicles such as cars, trucks, and motorcycles, public transportation vehicles such as busses, trains, and aircraft, emergency vehicles such as fire trucks and ambulances, and many other types of vehicles.

Abstract: A mobile backhaul inter-mesh communication point forms an interface between a wireless mesh network on a first level and a wireless mesh network on a second, higher bandwidth, level. The two wireless networks are differentiated, e.g., by causing the mesh networks to be formed using different spectra, protocols or coding, or antennae. The mobile intra-mesh communication point functions as an access point in the lower level mesh network and as a relay point in the upper level mesh network. Utilizing mobile inter-mesh communication points facilitates deployment of wireless network access points while enabling the location of access points to follow the concentration of network users. Mobile inter-mesh communication points may be deployed in personal vehicles such as cars, trucks, and motorcycles, public transportation vehicles such as busses, trains, and aircraft, emergency vehicles such as fire trucks and ambulances, and many other types of vehicles.

Abstract: A mobile backhaul inter-mesh communication point forms an interface between a wireless mesh network on a first level and a wireless mesh network on a second, higher bandwidth, level. The two wireless networks are differentiated, e.g., by causing the mesh networks to be formed using different spectra, protocols or coding, or antennae. The mobile intra-mesh communication point functions as an access point in the lower level mesh network and as a relay point in the upper level mesh network. Utilizing mobile inter-mesh communication points facilitates deployment of wireless network access points while enabling the location of access points to follow the concentration of network users. Mobile inter-mesh communication points may be deployed in personal vehicles such as cars, trucks, and motorcycles, public transportation vehicles such as busses, trains, and aircraft, emergency vehicles such as fire trucks and ambulances, and many other types of vehicles.

Abstract: A mobile backhaul inter-mesh communication point forms an interface between a wireless mesh network on a first level and a wireless mesh network on a second, higher bandwidth, level. The two wireless networks are differentiated, e.g., by causing the mesh networks to be formed using different spectra, protocols or coding, or antennae. The mobile intra-mesh communication point functions as an access point in the lower level mesh network and as a relay point in the upper level mesh network. Utilizing mobile inter-mesh communication points facilitates deployment of wireless network access points while enabling the location of access points to follow the concentration of network users. Mobile inter-mesh communication points may be deployed in personal vehicles such as cars, trucks, and motorcycles, public transportation vehicles such as busses, trains, and aircraft, emergency vehicles such as fire trucks and ambulances, and many other types of vehicles.

Abstract: Described are a method and system for secure transmission of data through a network. A subcarrier sequence for data transmission is generated. The subcarrier sequence designates at least one subcarrier from a number of orthogonal subcarriers for each of a plurality of intervals in a time sequence. The subcarrier sequence is provided to a receiver. A data signal that includes the subcarriers identified in the subcarrier sequence modulated according to the data is transmitted from a transmitter to the receiver. For additional security, the subcarrier sequence can be transmitted to the receiver using a communications channel that is separate from the communications channel for the data signal. The data signal is detected at the receiver and demodulated according to the subcarrier sequence.

Abstract: A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and performance of a microelectronic module. The method may comprise forming a discrete package, wherein the discrete package comprises one or more passive devices that are desirable for the performance of the microelectronic module. The method may also comprise coupling the discrete package to the microelectronic module.

Abstract: A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission lines and EMI. Further, groups of dielectric-core transmission lines may be disposed within a single grounded shield. For example, edge coupled differential pairs may be disposed in parallel with each other on a plane defined by a layer of the printed circuit board, i.e., side-by-side. Further, broadside-coupled differential pairs of dielectric-core transmission lines may be disposed in parallel with each other in a stack which is orthogonal with the plane defined by a layer of the printed circuit board, i.e., one on top of the other. Further, a plurality of dielectric-core transmission lines which may include all or ones of single-ended lines and differential pairs may be disposed within a single grounded shield.

Abstract: A technique for filter-enhanced clock synchronization is disclosed. In one particular exemplary embodiment, the technique may be realized by/as a method for filter-enhanced clock synchronization. The method comprises subjecting a clock error signal to a first exponentially weighted moving average (EWMA) filter to generate a first output signal, where the first EWMA filter comprises a first gain element. And the method further comprises subjecting the first output signal to a second EWMA filter to generate a second output signal, where the second EWMA filter comprises a second gain element and the second EWMA filter is coupled with a feedback loop having a delay element and a summing junction.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. The technique may be realized as a method for routing one or more conductive traces between a plurality of electronic components of a multilayer signal routing device. The method comprises forming a first inter-component channel at a first routing layer of the multilayer signal routing device, the first inter-component channel extending between a first set of two or more electronic components of the plurality of electronic components and having a first orientation and forming a second inter-component channel at a second routing layer of the multilayer signal routing device, the second inter-component channel extending between a second set of two or more electronic components of the plurality of electronic components and having a second orientation different from the first orientation.

Abstract: A technique for improving power/ground flooding is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for improving power and ground flooding in a multilayer circuit board, the multilayer circuit board having a plurality of signal layers. The method may comprise forming a plurality of electrically conductive vias, wherein each of the plurality of electrically conductive vias extends through one or more of the plurality of signal layers. The method may also comprise routing signals associated with the plurality of electrically conductive vias, thereby creating at least one power/ground flooding channel. The method may additionally comprise forming at least one power/ground connection within the at least one power/ground flooding channel.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: Exemplary techniques for tuning the effective capacitance provided by an embedded capacitor are disclosed. The techniques may be realized by modifying one or more conductive features of one or more vias connected to the embedded capacitor to adjust the capacitance contributed by the one or more vias. One technique preferably includes altering the conductive surface area of a pad of one or more vias to which the embedded capacitor is electrically connected to increase or decrease the contributed capacitance. Another technique provides for bore drilling or tap drilling one or more vias connected to the embedded capacitor to increase the surface area of plated interior surfaces of the vias, thereby increasing their capacitive effect. An additional technique includes forming a number of vias having various capacitive effects and electrically connecting the embedded capacitor to one or more of these vias to increase the capacitance.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: Described are a method and system for secure transmission of data through a network. A subcarrier sequence for data transmission is generated. The subcarrier sequence designates at least one subcarrier from a number of orthogonal subcarriers for each of a plurality of intervals in a time sequence. The subcarrier sequence is provided to a receiver. A data signal that includes the subcarriers identified in the subcarrier sequence modulated according to the data is transmitted from a transmitter to the receiver. For additional security, the subcarrier sequence can be transmitted to the receiver using a communications channel that is separate from the communications channel for the data signal. The data signal is detected at the receiver and demodulated according to the subcarrier sequence.

Abstract: Inter-layer shielding is employed to shield printed circuit board transmission lines from EMI and cross-talk at traversals between adjacent inner layers, between inner layers separated by one or more inner layers, between an outer layer and an adjacent inner layer, between an outer layer and an inner layer separated by one or more inner layers, and between an outer layer or inner layer and a component. Inter-layer shielding may be employed in conjunction with intra-layer shielding to provide shielding for an entire run of a transmission line spanning multiple layers. Inter-layer shielding may also be employed around component contacts such as electrically conducting pins. The shielding around the component contacts is designed to mate with a second portion of inter-layer shielding connected with intra-layer shielding such that an overlap is formed.

Abstract: A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device having a plurality of electrically conductive signal path layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer signal routing device. In such a case, the method comprises routing electrical signals on the plurality of electrically conductive signal path layers in the multilayer signal routing device for connection to and from a high density electrically conductive contact array package based at least in part upon at least one of an electrically conductive contact signal type characteristic and an electrically conductive contact signal direction characteristic.

Abstract: Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the multilayer signal routing device has a plurality of electrically conductive signal path layers for routing a plurality of electrical signals thereon. The method may comprise forming a plurality of electrically conductive vias in the multilayer signal routing device for electrically connecting at least two of the plurality of electrically conductive signal path layers, wherein the plurality of vias are arranged so as to form at least one channel in at least one other of the plurality of electrically conductive signal path layers. The method may also comprise grouping at least a portion of the plurality of electrical signals based at least in part upon their proximity to the at least one channel so that they may be efficiently routed therein.

Abstract: A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Abstract: A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and performance of a microelectronic module. The method may comprise forming a discrete package, wherein the discrete package comprises one or more passive devices that are desirable for the performance of the microelectronic module. The method may also comprise coupling the discrete package to the microelectronic module.