Patents by Inventor Ang L. Eng

Ang L. Eng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating a printed circuit for DCA semiconductor chips
    Patent number: 5525204
    Abstract: Fabricating a printed circuit by forming layers of metallization in a predetermined sequence, where each layer is formed in a predetermined pattern, with a layer of plating formed at selected locations of the printed circuit. Subsequently, forming a layer of insulation over the layers of metallization, except at the selected locations.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: June 11, 1996
    Assignee: Motorola, Inc.
    Inventors: John Shurboff, Ang L. Eng