Abstract: Processing methods may be performed to form an airgap in a semiconductor structure. The methods may include forming a high-k material on a floor of a trench. The trench may be defined on a semiconductor substrate between sidewalls of a first material and a spacer material. The methods may include forming a gate structure on the high-k material. The gate structure may contact the first material along each sidewall of the trench. The methods may also include etching the first material. The etching may form an airgap adjacent the gate structure.

Abstract: Processing methods may be performed to form an airgap in a semiconductor structure. The methods may include forming a high-k material on a floor of a trench. The trench may be defined on a semiconductor substrate between sidewalls of a first material and a spacer material. The methods may include forming a gate structure on the high-k material. The gate structure may contact the first material along each sidewall of the trench. The methods may also include etching the first material. The etching may form an airgap adjacent the gate structure.

Abstract: A memory circuit may include a memory array, and the memory array may include a plurality of data columns. The plurality of data columns may be configured to store data bits and provide data signals when selected by a read operation. The memory array may also include one or more reference columns distributed in the memory array and configured to provide a reference signal. The reference signal may track with process, voltage, and temperature variations that are specific to the memory array, and may be used to remove a common signal component and adjust the signal level to distinguish between logic 0 and logic 1 data signals.

Abstract: A memory circuit may include a memory array, and the memory array may include a plurality of data columns. The plurality of data columns may be configured to store data bits and provide data signals when selected by a read operation. The memory array may also include one or more reference columns distributed in the memory array and configured to provide a reference signal. The reference signal may track with process, voltage, and temperature variations that are specific to the memory array, and may be used to remove a common signal component and adjust the signal level to distinguish between logic 0 and logic 1 data signals.

Abstract: A memory circuit includes a memory array with one or more reference columns providing a reference signal and a data column providing a data signal when selected by a read operation. The memory circuit also includes a first circuit that removes a common signal component from the reference signal and from the data signal, along with a second circuit that adjusts the reference signal to be between a logic 1 signal level and a logic 0 signal level. The memory circuit also includes a sense amplifier that determines whether the data signal represents a logic 1 or a logic 0 using the reference signal after the common signal component is removed and after being adjusted, along with the data signal after having the common signal component removed.