Abstract: A lead assembly includes a thin film body supporting a plurality of electrodes configured to provide electrical stimulation or sensing. The thin film body includes a substrate. A plurality of electrode connection traces is situated on the thin film body and electrically connected to respective ones of the plurality of electrodes. A connection wire is configured to provide stimulation or sensing signals for transmission to the plurality of electrodes. The connection wire extends from a lead and is substantially larger than each of the electrode connection traces. A coupling structure is configured to provide electrical connection between the connection wire and the electrode connection traces.