Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.

Abstract: The present disclosure relates to a biocompatible, in vitro probe system. The probe system may have a substrate and a culture well supported on the substrate. The culture well defines a three-dimensional volume for containing in vitro cultures of electroactive cells. The probe system has at least one probe subsystem supported on the substrate. The probe subsystem has at least one probe having an array of electrodes, with the probe being disposed within the culture well for in vitro electrically communicating with the electroactive cells. The probe subsystem is adapted to be interfaced to an external instrumentation/recording device.

Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.

Abstract: The present disclosure relates to a biocompatible, in vitro probe system. The probe system may have a substrate and a culture well supported on the substrate. The culture well defines a three-dimensional volume for containing in vitro cultures of electroactive cells. The probe system has at least one probe subsystem supported on the substrate. The probe subsystem has at least one probe having an array of electrodes, with the probe being disposed within the culture well for in vitro electrically communicating with the electroactive cells. The probe subsystem is adapted to be interfaced to an external instrumentation/recording device.

Abstract: In one embodiment, a system includes a bioreactor coupled to a substrate. The bioreactor includes: a plurality of walls defining a reservoir; a plurality of fluidic channels in at least some of the walls; a fluidic inlet in fluidic communication with the reservoir via, the fluidic channels; a fluidic outlet in fluidic communication with the reservoir via the fluidic channels; and one or more sensors coupled to the reservoir, each sensor being configured to detect one or more of: environmental conditions in the reservoir; and physiological conditions of one or more cells optionally present in the reservoir. In another embodiment, a method includes delivering media to a reservoir of a bioreactor; delivering a plurality of cells to the reservoir, controlling a reservoir temperature and a reservoir gas composition; using one or more of the sensors to monitor environmental and physiological conditions; and reporting the environmental and/or physiological conditions.

Abstract: The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.

Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.

Abstract: A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.

Abstract: The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.

Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.

Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.

Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.

Abstract: A flexible device insertion tool including an elongated stiffener with one or more suction ports, and a vacuum connector for interfacing the stiffener to a vacuum source, for attaching the flexible device such as a flexible neural probe to the stiffener during insertion by a suction force exerted through the suction ports to, and to release the flexible device by removing the suction force.

Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.

Abstract: An optical waveguide integrated into a multielectrode array (MEA) neural interface includes a device body, at least one electrode in the device body, at least one electrically conducting lead coupled to the at least one electrode, at least one optical channel in the device body, and waveguide material in the at least one optical channel. The fabrication of a neural interface device includes the steps of providing a device body, providing at least one electrode in the device body, providing at least one electrically conducting lead coupled to the at least one electrode, providing at least one optical channel in the device body, and providing a waveguide material in the at least one optical channel.

Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Abstract: A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.

Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.